Moldex3D

Zhubei City,  Hsinchu County 
Taiwan
http://www.moldex3d.com
  • Booth: K2866
  • - 1st Floor


Innovative Moldex3D, helping you to maximize product ROI.

About CoreTech System (Moldex3D)
CoreTech System Co., Ltd. (Moldex3D) has been providing the professional CAE analysis solution “Moldex” series for the plastic injection molding industry since 1995, and the current product “Moldex3D” is marketed worldwide. Committed to providing advanced technologies and solutions to meet industrial demands, CoreTech System has extended its sales and service network to provide local, immediate, and professional service. CoreTech System presents innovative technology, which helps customers troubleshoot from product design to development, optimize design patterns, shorten time-to-market, and maximize product return on investment (ROI). More information can be found at Moldex3D Website.


 Press Releases

  • Hsinchu, Taiwan — May 05, 2022 — CoreTech System Co., Ltd. (Moldex3D) announced the release of Moldex3D 2022 today – the latest version of its molding analysis software series. The brand new Moldex3D continuously reinforces the system constructure and improves analysis performance, aiming to deliver more accurate molding results for users. CoreTech also provides new services regarding smart design, smart management, and smart learning that help corporations take the first step in the smart era, achieving seamless design, production integration, and team efficiency.

    The important updates and highlights of Moldex3D 2022 are as follows:: 

    Automate  Analysis Optimization  

    Helping customers gain manufacturing advantages has always been the core belief of Moldex3D. The new version of Moldex3D 2022 supports user-customized simulation results and reporting, which facilitates team communication, and establishes analysis standardization.

    Moldex3D 2022 has upgraded features to provide timely point and plane measurements for users to track core problems in molding results. Design of Experiment (DOE) analysis wizard can be used to identify key influencing factors and optimize product quality. DOE and Shell analysis are supported on the Linux platform, which can greatly reduce calculation cost, shorten the calculation time and speed up development. Moldex3D Studio also provides versatile API functions to help users build automated analysis, compare simulation results, optimize process, and even realize intelligent integration.

    To help users control the two most critical factors, machine and material properties, in the molding process, Moldex3D developed Machine Characterization Services to capture unique performance and dynamic responses from each molding machine, which are also integrated into CAE analysis to reflect real manufacturing conditions, presenting more accurate simulation results.

    Regarding material support, Moldex3D has established a professional material measurement center with ISO/IEC 17025 certification. It has decades of plastic data measurement technology and experiences to construct complete material digital twins, improving prediction accuracy on injection pressure, warpage, and shrinkage. 

    Connect Key Data and Enhance Design Energy

    If every parameter can be implemented in the design stage, it can significantly reduce cost in mold trials. Moldex3D SYNC geometry optimization supports Design of Experiment (DOE) and can perform geometrical analysis on critical dimensions, understanding the possible defects of molding.

    Moldex3D 2022 has also greatly enhanced runner, gate, and cooling wizards. It not only strengthens the design of runners and cooling line systems, but also provides more diverse layouts for different situations, making the design more flexible.

    In terms of mesh, we optimized the quality and efficiency of mesh generation, enhanced preprocessing, CAD import, mesh functions, and geometry healing functions, allowing users to repair geometric defects more easily and improve model quality.

    In IC packaging simulations, it has more powerful modeling capabilities for various processes, provides a more complete IC Auto Mesh function, and allows users to freely create advanced packaging such as CoWoS and InFO types. 

    Build Your Own Digital Think Tank

    Every mold tryout is a precious digital asset for companies. To better utilize these resources, Moldex3D iSLM records the entire development process of design and mold trial. This data is uploaded to the cloud system, so multinational team members can access, share, and reuse simulation data anytime, anywhere, accelerating R&D innovation, save considerable management costs, and a more efficient teamwork.

    Create a High-performance Learning Environment

    As technology has been changing more rapidly than ever, enterprises are looking for better ways to train their future talents. With decades of solid industry experiences, Moldex3D has launched the MPE digital learning system (Moldex3D Plastics E-Learning), providing professional terminology in the plastic molding industry, knowledge of injection molding machines, and real case studies collected from decades of industrial experiences. There are also tests after each session for students to validate their learning results. It helps people who are new in the industry to strengthen practical capabilities and enhance competitiveness more effectively.

    For more information about the new features of Moldex3D 2022, please visit: https://www.moldex3d.com/products/moldex3d-2022

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 Products

  • Moldex3D IC Packaging
    Plastic Chip Encapsulation is a molding process where chips are being capsulated with EMC to prevent physical damage or corrosion. Common defects include incomplete fill, air traps, voids, wire sweep, paddle shift, package warpage, etc....

  • Moldex3D IC Packaging Overview

    Plastic Chip Encapsulation is a molding process where chips are being capsulated with Epoxy Molding Compound (EMC) to prevent physical damage or corrosion. This process contains the interconnection between microchips and other electronics (so-called wire bonding), curing phenomenon of thermoset material, and various control management of process conditions. Due to the complexity of multiple material components, such as EMC, chip, or leadframe, and high wire density, many challenges and uncertainty have been brought to the Chip Encapsulation process. Common defects include incomplete fill, air traps, voids, wire sweep, paddle shift, package warpage, etc.

    Moldex3D IC Packaging provides a complete series of molding solutions, and supports comprehensive solutions such as : Transfer Molding, Molded Underfill, Capillary Underfill (CUF), Compression Molding, Embedded Wafer Level Package (EMWLP), and No Flow Underfill (NFU) / Non Conductive Paste (NCP). Auto meshing function supports for user to complete encapsulation analysis more easily. User also can adopt advanced manual meshing for more complex component like undercut-shaped lead frame.

    Moldex3D IC Packaging helps designers to fully analyze the chip encapsulation process from filling, curing, cooling, to advanced manufacturing demands, such as filler concentration, underfill encapsulation, post-molding curing, stress distribution, or structural evaluation. Significant molding problems can be predicted and solved upfront, which helps engineers enhance chip quality and prevent potential defects more efficiently. The accurate simulation also helps design optimization and well cost management.


    Melt front result in mold


    In Wire Sweep Analysis, deformed wires are compared with original wires based on the wire sweep

     

    Download IC Packaging Brochure

    For more information about Moldex3D IC Packaging, please visit:
    https://www.moldex3d.com/products/software/moldex3d-ic-packaging/