NI Taiwan

Taipei City, 
Taiwan
http://www.ni.com/semiconductor
  • Booth: I3127
  • - 1st Floor

NI semiconductor test customers report 10X improvement in test times while maintaining measurement and performance requirements. To test smart devices, organizations are transitioning from traditional ATE and box instruments to a platform-based approach. NI's platform-based approach from characterization to production offers cost-optimized, high-performance test solutions for RF and mixed-signal test. Come to NI’s booth to understand more about its uniqueness.

 Products

  • PXIe-4190 2-in1 LCR Meter & SMU
    You can use PXIe-4190 for better CV-IV automated test systems for semiconductor applications including integrated passive device (IPD), MEMs, MLCC, and parametric testing....

    • PXIe, Up to 2 MHz, Up to 40 V PXI LCR Meter—The PXIe-4190 helps you measure and test the inductance, capacitance, and resistance (LCR) of electronic equipment. It includes an LCR meter with fF-class capacitance measurements and a precision source measure unit (SMU) with fA-class current measurements. You can use PXIe-4190 meter in capacitance-voltage/current-voltage (CV/IV) automated test systems for semiconductor applications including integrated passive device (IPD), microelectromechanical systems (MEMs), multi-layer ceramic capacitor (MLCC), and parametric testing. Additionally, the PXIe-4190 is supported by the NI-DCPower instrument driver, which includes APIs for LabVIEW, C, C# .NET, Python, and other programming languages.
  • NI Semiconductor Test System (STS)
    STS is a production-ready ATE solution for RF, mixed-signal, and MEMS semiconductor devices that helps improve time to market and lower the cost of test....

    • Smarter Alternative for Semiconductor Production Test

    Optimized for throughput and cost, STS is a production-ready ATE solution for RF, mixed-signal, and MEMS semiconductor devices. STS is ready for the production test cell, with support for manipulators, handlers, and wafer probers, and a standard spring pin layout enables highly transferable test programs and load boards. STS features a unified set of software tools for quickly and efficiently developing, debugging, and deploying test programs. To complete the solution, NI offers comprehensive engineering services, bring-up services, training, and support.

    Key Benefits

    • Comprehensive Portfolio of RF, Digital, and DC Instrumentation – You can customize new STS configurations and upgrade existing testers to include the instrumentation resources you need while maintaining test program and load board transferability. 
       
    • Unified Software Experience – STS Software provides the tools needed to develop, debug, and deploy multisite test programs, including pin mapping, test limit importing/exporting, binning, and STDF reporting.
       
    • Prebuilt Test Code—You can use drag-and-drop software templates for common semiconductor test operations such as continuity checks, leakage tests, digital pattern bursts, or RF waveform generation or acquisition for the latest wireless standards like 5G NR.
    • Test Cell Integration—The standard docking and interfacing infrastructure allows for seamless integration with manipulators, device handlers for package test, and wafer probers for wafer test.
       
    • System Calibration – You can perform system-level in-situ calibration of digital and DC resources up to the spring probe interface and RF resources up to the blind mates, with options to consume vector de-embedding files for calibrating up to the DUT plane.
       
    • Services and Support—Comprehensive engineering services, bring-up services, training, and technical support help you get up and running quickly.

  • Wafer-Level Parametric Test
    Wafer-level test engineers need to reduce test time without sacrificing measurement quality and accuracy....

    • Modular PXI platform

    A Smarter Approach to Wafer-Level Parametric Test

    As IC manufacturers continue to introduce new and innovative processes with decreasing device geometries, they need to ensure the additional complexity from these changes does not affect the long-term reliability of their ICs. As technologies evolve at a rapid pace, semiconductor manufacturers must increase the amount of reliability data they collect and analyze while decreasing the cost of test. When faced with this problem of more data at a lower cost, many reliability engineers find they cannot solve it using traditional reliability solutions, so they are turning toward modular, flexible solutions that can scale to fit their needs.

Categories

208 Equipment, Test
  • Functional Test Systems
  • Linear Test Systems
  • Logic Test Systems
  • Optical Test Systems
  • Parametric Test Systems
  • Printed Circuit Board; Wire Board (PCB or PWB) Test and Repair
  • System on a Chip (SOC); Mixed Signal Test Systems
  • Wireless, non-contact Test Systems
    • 701 Manufacturing Services or Consulting
  • Test Services or Consulting
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