Glass, fused silica and silicon for MEMS and semiconductors.
Plan Optik AG, a public company from Germany produces wafers from glass, quartz and glass-silicon-compounds. Main products are wafers and process carriers from glass, fused silica and glass-silicon compounds for MEMS, wafer level packaging and semiconductor processing as well as process carriers for semiconductor wafers. Plan Optik's wafers are machined to very tight thickness tolerance and total thickness variation. Sub-nanometer roughness and materials with adapted coefficient of thermal expansion to semiconductor materials are the main features of these substrates and carriers. All wafers are clean room packed. Diameters from 50 to 300 mm, typical thickness from 100 to 3000 micron. Customized cavities and holes manufactured by wet etching, ultra sonic drilling and sand blasting. Si-glass-compound wafers, micro lens- and conductive via wafers for WLP. Plan Optik has set the standard in respect to high end substrates for the MEMS and semiconductor industry.
Plan Optik 為德國上市公司，主要產品是用於微機電、晶圓級封裝技術以及半導體製程的玻璃晶圓、石英晶圓以及玻璃矽鍵合晶圓。由 Plan Optik 開發的先進加工技術可讓晶圓控制到極小的厚度公差與極低的表面平整度。適用於半導體的納米級熱膨脹係數材料是Plan Optik 基板與載具的主要特點。Plan Optik所生產的晶圓皆為無塵室包裝，晶圓尺寸由50mm到300mm，厚度範圍從100到3000 micron。表面鑽孔與腔體可依客戶需求做濕蝕刻加工、超音波加工、與噴砂加工。Plan Optik為微機電與半導體產業的材料加工先驅，透過新開發用於晶圓級封裝的矽+玻璃鍵合晶圓及微透鏡，成為業界標準。