RENA Technologies GmbH

Gütenbach, 
Germany
http://www.rena.com
  • Booth: I3130
  • - 1st Floor


Welcome to RENA Technologies GmbH!

About RENA Technologies GmbH

RENA - The art of wet processing.

RENA Technologies is the worldwide technological leader for wet chemical equipment. 

We provide the most valuable, innovative wet-chemical solutions for our clients to reach the next level of state-of-the-art.
We manufacture highest quality flexible and high-throughput equipment for producing semiconductor products for all manner of different sectors.
RENA equipment is used to treat the surfaces of semiconductor wafers, like etching, plating, cleaning and drying with standardized machines and guaranteed processes or entirely customized equipment.

We have 7 manfacturing sites, 5 innovation hubs and more than 3,300 machines installed worldwide. We are constantly developing the most efficient process for our clients to achieve perfect surface quality. With more than 130 engineers, 150 global service experts at 20 service locations we work to make RENA machines a long-term success story.

For more information, visit https://www.rena.com.

 Products

  • FCS - Final Cleaning System
    The RENA Final Cleaning System provides highest quality surfaces for the last wafering step. Sophisticated processes and advanced scheduling make it the perfect solution for semiconductor wafer production with high throughput and challenging requirements....

    • Superior surface cleanliness for wafers up to 300 mm
    • Fully automated LMC carrier handling
    • Perfect finishing with RENA Marangoni Dryer
    • Standard SEMI interfaces for easy fab integration
  • AES – Acid Etching System
    The RENA AES wet etching tool is built to achieve outstanding results in wafer production. Acidic etching combined with a fast transport system enables precise process control....

    • For wafers up to 300 mm this fully automated tool fulfills all requirements for high-end wafer production and is completely compliment to all SEMI-standards. On top the carrier-less half-pitch processing capabilities guarantee highest throughput rates.

    • Carrierless handling
    • Half-pitch system for highest throughput
    • Advanced process monitoring
    • Up to 300 mm wafer size
    • Outstanding shape control
    • Etch stop in under 1 second
    • Multi-wafer transport to OHT loadport
  • Parts Cleaning – Solano
    The Solano is an semi-automatic cleaning system, for your support of contamination control on all common types of FOUP´s and FOSB´s....

    • An optimized Hot-DIW spray cleaning system supported through the permanently rotating of the carousel achieve best cleaning results. If desired by adding a surfactants (cleaning detergent), optionally. Drying via an fast centrifugal force power and high quality hot air supplying through an integrated HEPA filter-unit. Regular cleaning enables an efficient reduction of particle and metal contaminations on and inside your products.

    Product details:

    • Up to 99 recipes, each with 20 cleaning steps
    • Variable data input (time, temperature, speed,
      parameter, etc.)
    • Hot air dryer with humidity sensor
    • Fan-unit with adjustable speed for standby
      and process mode
    • Unbalanced sensor for automatic shut off
    • Front side operation
    • Illuminated process chamber
  • BatchGlass LF HTX
    The BatchGlass LF HTX is a fully-automated wet processing tool for large size glass substrates....

    • RENA´s highly sophisticated hot alkaline etching tool can handle up to 600 x 600 mm2 glass panels. Showing highest performance in homogeneity for thinning as well as structuring and via etching processes. This is crucial for combined laser and etching applications like through glass vias (TGV) used in semiconductors and micro LED displays.

    Product details:

    • Advanced hot alkaline technology for selective and controlled etching
    • Highest homogeneity standards for hot alkaline etching
    • Etching after laser modification for TGV manufacturing
    • Highest surface cleanliness and quality
    • RENA CLEAN process specialized for silicate removal
    • Optimized footprint and compact design
    • 24/7 operation and easy upscaling of process
  • Electro Plating Manual – EPM 2
    The EMP 2 is a compact electro-plating system for semiconductor device manufacturing and packaging applications, such as UBM, Bumping, Cu pillars, TSVs, Blind vias, RDL, Micro Forming and more....

    • Highest flexibility is required for pure metal and alloy deposition in the Microelectronic, Optoelectronic & Photonic chips market and its wide range of plating applications. The EPM 2 delivers precisely this. Homogeneous deposition at highest plating rates is ensured by optimized electrolyte flow and electrical field control in the fountain system. The plating tool operates manually and can be installed in R&D environments as well as in small scale production.

    Product details:

    • Different substrate sizes
    • Adjustable wafer thickness
    • Plating materials:
      Pure metals: Cu, Au, Ni, In, Sn, Pt 
      Alloys: SnAg, PbSn, FeNi

Categories

701 Manufacturing Services or Consulting
  • Equipment; Hardware; Product Design, Integration and Manufacturing
  • Manufacturing Process Support and Development
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