Scientech Corporation

Scientech provides 4” & 6” SiC wafer reclaim service by professional reclaim technique, new equipment/ utility and advanced process technology for high quality SiC substrates.

Process Capability

• Grinding
   - Surface roughness, Ra: ~1nm
   - TTV: < 3um
•  Polishing
   - Surface roughness, Ra: ~1A
•  Cleaning
   - Surface cleanness, LPD <0.3um
   - Surface Metal < 1E10 Atoms/cm² (By ICP-MS)
•  Inspection(Geometry/ Defect)
   - FRT/ Candela
   

Scientech provides 12” wafer reclaim service and 12” test wafer.  Our team is formed by professional reclaim technique, new equipment/ utility and advanced process technology for 7/5 nm IC design rules.  Our customers are covered in major Logic, DRAM Fab, equipment, and research lab worldwide. 

Our Mission：

•  Minimum Removal Rate
•  Maximum Return Rate
•  Minimum Return Time
•  Robust Quality System
•  Accurate Tracing System
•  Quick Respond System

辛耘企業於2002年開始投入批次式及單晶片式濕式製程設備研發製造，已經獲得國內外客戶採用與肯定。目前辛耘擁有 5,000 m2生產製造廠房，同時擁有 Class 10 等級無塵室服務客戶製程需求驗證平台。產品包含手動 / 半自動 / 全自動的批次式及單晶片製程設備提供客戶2”~ 12”製程應用需求。特有的 cassette type / boat type / cassette-less type 技術提供半導體晶圓、藍寶石、玻璃、LED、太陽能晶圓、薄化晶圓等應用。另外，辛耘企業擁有的專利產品”Advantech Dry”提供客戶各種關鍵旋乾的製程應用。

辛耘新開發Sirius系列設備，結合批次式及單晶片式濕製程優點並擁有特殊垂直高壓噴洗技術提供製程彈性。應用領域含括:

Sirius Series濕製程設備:

• Applications :
• Advanced Packaging / Bumping
• Compound Semiconductor
• LED / Mini LED / Micro LED

Process :

• MLO (Metal Lift-off)
• Dry Film PR Strip

辛耘企業的特色：

• 客製化軟硬體設計服務
• 專業與快速的售後服務
• 安全設計兼具簡易操作
• 主動協助客戶快速量產

辛耘企業於2002年開始投入批次式及單晶片式濕式製程設備研發製造，已經獲得國內外客戶採用與肯定。目前辛耘擁有 5,000 m²生產製造廠房，同時擁有 Class 10 等級無塵室服務客戶製程需求驗證平台。產品包含手動 / 半自動 / 全自動的批次式及單晶片製程設備提供客戶2”~12”製程應用需求。特有的 cassette type / boat type /e cassette-lett type 技術提供半導體晶圓、藍寶石、玻璃、LED、太陽能晶圓、薄化晶圓等應用。另外，辛耘企業擁有的專利產品”Advantech Dry”提供客戶各種關鍵旋乾的製程應用，應用領域包括:

Single Wafer單晶片式濕製程設備 ( Polar Series ):

Applications :

Advanced Packaging / Bumping

Semiconductor : BEOL, GaAs

Process:

UBM / Metal Etch

Si Etch / Oxide Etch

Flux Clean

PR Strip

Mask Clean

Frame type Clean

Final Clean

Wafer Clean (APC, Soft Spray)

Wet Bench批次式濕製程設備 ( WSE Series):

Applications :

Advanced Packaging / Bumping

Semiconductor : FEOL, BEOL, GaAs

LED / Solar cell

Process :

Etch: Metal, UBM, Oxide removed, Si3N4 removed

Stripper: PR/PI strip, Polymer remove,

Clean: Pre-clean, Post clean, Flux clean

Plating: Electro-less plate (Zn/Ni/Au), Electric plating (Cu/Ni/SnAg)

辛耘企業的特色：

客製化軟硬體設計服務

專業與快速的售後服務

安全設計兼具簡易操作

主動協助客戶快速量產

辛耘企業於2015年開始投入暫時性貼合設備研發製造，已經獲得國內外重要客戶採用與肯定。目前辛耘擁有 5,000 m²生產製造廠房，同時擁有 Class 10 等級無塵室服務客戶製程驗證平台。產品包含手動/半自動/全自動的暫時性貼合、剝離、解離層成型及載具清洗回收系統，提供客戶6”~12”製程應用需求。

TBDB暫時性貼合/剝離設備 (Pyxis series):

• Applications :
  • Power Device: IGBT, MOSFET
  • Advanced Packaging: Fan-out, 3DIC, TSV, 2.5D Interposer
• Process:
  • Temporary Bonding System
  • Temporary De-bonding System
    • Frame De-bonding System
    • Taiko De-bonding System
  • Release Layer Formation System
  • Carrier (Glass) Recycling System

我們的特色：

• 客製化軟硬體設計服務
• 專業與快速的售後服務
• 安全設計兼具簡易操作
• 主動協助客戶快速量產

Mask / Reticle
Mask Dry Etcher, CD / Overlay Metrology, E-beam Writer, Reticle Cassette

Lithography Process
Stepper, Coater / Developer, Curing Furnace, Mercury Lamp

Etch Process
Dry Etch, Plasma Cleaning / Descum, End Point Detection

Thin Film & Thermal Process
High Pressure Gas Anneal and Oxidation Furnace, Electro-Plating System, PECVD, CVD, Pulsed Laser Deposition, RTP

Metrology & Inspection
Optical / Stylus Profiler, Standards, AFM, 3D X-Ray Microscopy, Laser Marker, Isolation Systems, Stress Meter, Nanoindenter

Sub-Systems & Others
Power Supply, RF Generator, Robot, EFEM, Pressure Sensor, Valves, Metal Cassette, Magazine, KVM

Flat Panel Display
Dry Etch, PECVD, Annealing Furnace, PI Curing Furnace, PVD, Mask / Cassette Cleaner, Optical / Stylus Profiler, AP Plasma Clean

Battery
Cell Stacking, Degas, X-ray inspection, Secondary Battery Cell Automation Production Tools

Analytical Inst.
Particle Sizer, Pre-Treatment, Element Analyzer