SEMI Inspection and Metrology Committee WG2
Platform of Advanced Packaging Inspection
“SEMI Inspection and Metrology Committee WG2: Advanced packaging inspection” is dedicated to the pursuit of More than Moore through the developments of inspection and metrology technologies which may aid the evolving of semiconductor advanced process about 3D-IC. This group has included research institutes, equipment suppliers, and manufacturers to discuss the insights on challenging problems for the semiconductor industry. Relevant enterprises and experts who share the same interests of measurements for heterogeneous integration and advanced packaging are welcomed to join this working group.