Sil-More Industrial Ltd.

Sanchong Dist.,  New Taipei City 
Taiwan
http://www.silmore.com.tw
  • Booth: K2781
  • - 1st Floor


Welcome to visit Sil-More booth no. #K2781 (1F) !!!


Professional Integrated Total Solutions Provider

Sil-More Group was founded in 1995. Our main focus is the promotion of adhesive materials used in high tech Industrial applications, introducing domestic and well known American and European materials to satisfy the field application requirement for adhesive/sealants, encapsulates/potting, conformal coating, die adhesive/chip protectioan, conductive, thermal interface materials and engineering plastics in the electronics, Industrial, automobile, semiconductor, optoelectronics and aerospace industries. 

We have our own research and development center and over the years we are continuously assimilating new knowledge in the professional field, creating new innovative products. We have more than 10,000 local and international electronics manufacturing customers and we are capable to provide professionally integrated total solutions to them, becoming their most trusted professional supplier. Sil-More group will work closely with you to create a new era of future technology together.

Contact Us:

Tel: +886-2-85122222 | Fax:+886-2-85122988

Website: www.silmore.com.tw  | E-mail: service@silmore.com.tw


 Products

  • ME-4039
    矽膠基底<br />Silicone base<br />無附產物揮發<br />No byproducts<br />低離子不純物<br />Low levels of ionic impurities...

  • Die attach insulated adhesive for microelectronics packaging
    封裝用絕緣固晶矽膠
  • ME-1070
    矽膠基底<br />Silicone base<br />無附產物揮發<br />No byproducts<br />低應力<br />Low modulus...

  • Die attach insulated adhesive for microelectronics packaging
    封裝用絕緣固晶矽膠
  • ACH35006
    環氧樹脂改質基底<br />Hybrid base<br />燒結銀<br />Sintering Ag adhesive<br />高導熱率<br />High Thernal Conductive > 20W/mK...

  • Electrically conductive adhesive is designed for use in packages which need high thermal conductivity.
    高導熱/導電固晶銀膠
  • ME-1800
    6.8W/mk 導熱率<br />6.8W/mk thermal conductivity<br />低離子不純物<br />Low ionic impurities<br />含銀粒子,具導電性能<br />Contains silver filler, enables electrically conductive performance...

  • Adhesive is suitable for microelectronics thermal interface applications
    導熱/導電應用介面接著矽膠
  • ACE44073LV
    環氧樹脂基底<br />Epoxy base<br />低揮發<br />Low outgassing<br />低溫固化<br />Low temperature curing...

  • electrically conductive adhesive is designed for low temperature cure.
    低溫固化導電接著銀膠,
  • ACH35001LV
    溶劑配方系統<br />Solvent system<br />固化後高銀含量<br />High Ag content after curing...

  • Die attach adhesive uses solvent system in order to increase silver content after cure and to enhance reliability of devices.
    固化後,高固成份銀膠。有優異的的導電率和信賴性表現。