TECNISCO was established in 1970 as a processing service provider for precision components, taking advantage of DISCO Corporation's cutting and grinding technologies. Since then, we have developed and integrated our technology fields into a "Cross-edge" technology which crosses five leading-edge technologies such as cutting, grinding, polishing, metalizing, and bonding, thus supporting high-tech products in the industries of optical communication, industrial laser, AV/mobile, projector, automotive and medical devices.
Now, with “ The TECNISCO WAY “which clearly defined our corporate values, every single staff member of our company continuously challenges creativity and evolution. With our advanced "Cross-edge" technology, we promise that we will continue to provide first-grade products and services to our customers to become a real solution partner who can realize what our customers really want.
We will greatly appreciate your continued support and encouragement.
本公司成立於1970年，運用迪思科的研削切斷加工技術，接受精微部件的委託加工。
自公司成立以來，不斷地擴大技術領域,近年來,通過由切，削，磨，產品金屬化，鍵合這五個最先進技術匯聚而成的"Cross-edge"技術中所孕育出的產品/服務，向光通信，產業用激光，AV/移動通信，投影儀，車載器械,醫療器械市場等尖端產品領域擴展。
此外，在明確公司價值觀的“The TECNISCO WAY”的基礎上，每位公司職員都不斷進行獨創性的挑戰，養成了不斷進步的企業文化。通過我們獨創的精微加工技術，持續提供一流品質的產品和服務，當客戶提出的“這個是否也能加工?”的詢問時,我們會與客戶共同解決，實現成為真正的合作夥伴這一目標。
今後，望請各位給予更多的支持和指導。
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