【 FEATURE 】
- 01005/008004 超微型被動元件返修
- Mini / Micro LED 拆除/印錫/置放/回焊
- 除錫皆非接觸式快速除錫
- BGA 錫球單點式除錫/印錫/植球
- Pad多點精準印錫膏功能
- 晶片除膠返修
- 高清晰影像對位及返修流程監控
- 氮氣作業系統
- 氣浮式快速對位平台
- Profile報告及影像存取輸出
- Windows作業系統
【 PROCESSES 】
» Component removal/ De-soldering
» Contactless site cleaning/ Solder removal
» Re-balling/ Single ball re-balling
» Paste printing (component, PCB)
» Dipping
» Dispensing
» Soldering
【 APPLICATIONS 】
» Soldering of:
- Mini/ Micro LED
- BGA, μBGA/CSP, QFN, DFN, PoP, QFP, PGA , SON
- Small passives down to 01005 / 008004
- RF shields, RF frames
- Connectors, sockets
- Sub assemblies, daughter boards
» Pin in Paste (PiP)
» Through Hole Reflow (THR)
» Underfilled or coated components (reworkable)
» Rework on flex