Boschman Advanced Packaging Technology is a high-tech, technology driven company, specialised in advanced back-end semiconductor packaging solutions. We are a privately owned business, headquartered in the Netherlands with a system assembly facility in Singapore.
We focus on Pressure Sintering and Transfer Molding, two technologies that are in high demand now as the world is converting to high levels of electrification, creating unprecedented opportunities for companies active in the power electronics supply chain, like Boschman Advanced Packaging Solutions.
Core to our strategy is a unique business model, “from Idea to Industrialization”, with 3 highly complementary activities:
- Package Development: co-development of semiconductor packages and processes, including concept and design for manufacturing (DFM), prototyping and engineering samples for our (end) customers. Historically this activity was mainly focused on MEMS and Sensors, but for the last years this has shifted towards Power Modules and Inverters, driven by market demand in the xEV segment.
- Assembly Services: small to medium volume micro assembly of MEMS, Sensors and Power Modules, with a fully equipped inhouse lab (from wafer dicing to die attach bonding, molding and laser marking). For higher production volumes, we offer a technology transfer service to inhouse our OSATs manufacturing.
- Equipment: pressure sintering & transfer molding equipment, a range of systems suitable from R&D Labs up-to High Volume production solutions.