We provid hybrid bonding, Fan out, RDL, AOI solutions.
Overview
Saultech dedicated to study Pick & Place and Die Attach technology continually,The related technology of Chip Sorter and Die Bonder apply to LED、LD、IC and Lens backend assembly process,Under the existing structure for Pick & Place and Die Attach technology, continue to extend cooperation with customers, distributors and the other vendors in the same industry, to develop a variety of innovative and high CP value equipment,Saultech aims to become the solutions provider of world-class products and technologies.
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