Test Research, Inc. (TRI)

The TR7007Q SII is a cutting-edge 3D SPI system designed to enhance your production processes. With its high-speed platform, this system delivers a remarkable 50% faster cycle time compared to previous models, ensuring optimal efficiency. Experience improved accuracy and stability, allowing for precise solder measurements and minimizing false calls. Equipped with a wide spectrum light system and coaxial lighting*, the TR7007Q SII enhances contrast and detection rates, enabling you to capture intricate details with exceptional clarity. The 3D SPI is an Industry 4.0 Ready Solution supporting the upcoming and innovative protocols such as IPC Connected Factory Exchange (CFX) and IPC Hermes 9852 standard.  (*Optional)

Features:

• Wide Spectrum Light for Enhanced Contrast and Detection Rate
• Improved Accuracy and Stability for Precise Solder Measurements
• New motion controller, EtherCAT, for real-time measurements
• 100% Shadow-free Quad/Dual Digital Fringe projectors
• SmartWarp Compensation Eliminates Local PCB Deformation
• Smart Factory Solution with Real-time SPC Trends
• Closed Loop Ready: Feedback and Feedforward Capabilities

Inspection for: 

• 008004 / Metric 0201 Solder paste measurement
• Flux Inspection
• Mini-LED Inspection (03015)
• Black glue Inspection
• Wafer Solder paste measurement
• Ceramic substrate
• Solder Ball / Bumps measurement

The TR7700Q SII is powered by TRI's Smart Programming with auto-learning functionalities, flexible inspection algorithms, and metrology capabilities for exact measurements and data exchange for Smart Factory applications. The TR7700Q SII has a Higher Accuracy and improved Gauge R&R with Stop-and-Go Imaging Technology. The 3D AOI is an Industry 4.0 Ready Solution supporting the upcoming and innovative protocols such as IPC Connected Factory Exchange (CFX) and IPC Hermes 9852 standard.  (*Optional)

Features:

• Industry-Leading Inspection Speed, up to 57 cm²/sec
• Multiple 3D Technologies: Zero-escapes Inspection
• 2.5 μm High Resolution 25 MP Camera
• High Precision Metrology-grade Inspection
• High Accuracy Inspection with Improved GR&R
• Smart Factory Ready Solution

Inspection for: 

Die Bonding: Missing Die, Die Reverse, Die Shift, Die Rotation, Die Tilt, Die Chipping, Die Crack, Scratch Die, Contamination, Excess Epoxy, Insufficient Epoxy, Epoxy on Product.

Wire Bonding: Wire Broken, Wire Short, Wire Sweep/Sink, Missing/Excess Wire, Ball Bond Diameter, Stitch Width, Stitch Coverage over Ball, Ball Bond Cannot TouchPad Edge, Bond on Contamination/FM, Bump/Ball/Stitch Lifting, Neck Broken.

Component Defects: Missing, Tombstoning, Billboarding, Polarity, Rotation, Shift, Wrong Marking (OCV), Defective, Upside Down, Extra Component, Foreign Material, Lifted Component.

Solder Joint Defects: Solder Fillet Height, Solder Volume %, Excess Solder, Insufficient Solder, Bridging, Through-hole Pins, Lifted Lead, Golden Finger Scratch/ Contamination.

The TR7950Q SII is the latest 3D AOI from TRI for the Semiconductor Industry. The AI-Powered 3D Wafer AOI is a Fully Automated Wafer Macroscopic Inspection and Micro Measurement Solution with a Rigid Mechanical Structure of Linear Air Bearing capable of Multiple Imaging Technologies for Zero Escapes Inspection. The 3D AOI is an Industry 4.0 Ready Solution supporting the upcoming and innovative protocols such as IPC Connected Factory Exchange (CFX) and IPC Hermes 9852 standard.

Features:

• Fully Automated Wafer Macroscopic Inspection
• High Precision Micro Inspection Measurements 
• 2.5 μm High Resolution 25 MP Camera
• Inspection of Highly Reflective Surfaces
• Short Wave infrared (SWIR) imagıng Technology (Optional)
• Rigid Mechanical Structure Linear Air Bearing
• Automatically handles 8" / 12" wafers 
• Dust-free equipment Cleanroom ISO 5 (Class100)
• Smart Factory Ready Solution

Inspection for: 

Patterned Wafer: Residues、Crack、Scratch、Particle、Pad Abnormal、Discolor、Contamination、Peeling、Probe Mark Defect、CD Measurement.

Bump Wafer: 2D Bump Size、3D Bump Height、Bump Defect、Foreign Material、CD Measurement.

Wafer Frame: Chipping、Crack、Scratch、Particle、Contamination、CD Measurement、Saw 3D metrology

Optional: SWIR - Inner Crack、Inner Chipping