Lakeville, Minnesota, September 4, 2023 – ITW EAE will be showcasing its latest developments at Semicon Taiwan, September 6-8 at Taipei Nangang Exhibition Center in Taiwan. The ITW EAE booth L0416 will have MPM, Camalot, Electrovert and Vitronics Soltec Applications Experts on hand as well as Sales and Management to answer questions and offer solutions.
Camalot will be presenting live demonstrations of its Advanced Tilt and Rotate dispensing system. This innovative and new Camalot design reduces wet out areas and improves capillary flow for underfill by accurately dispensing on the side walls of packages. State-of-the-art rotary actuators provide a fast, high precision, zero backlash mechanism that allows proprietary motion and controls allow articulation of the dispense pump in sub-degree increments for both axes as many times as you need, in other words total flexibility.
MPM will present the Edison stencil printer. Edison has the industry leading accuracy and repeatability performance and is designed for SEMI printing challenges with proven ≥2CPK on 0201M spec supported by patented technologies. MPM will also display the EnclosedFlow print head patented technology with proven history in SEMI applications, delivering superb performance for super fine aperture and spacing printing jobs.
ITW EAE plays a major role in semiconductor packaging, including stencil printing solder and flux, dispensing underfills and encapsulant liquids, thermal processing die attach adhesives, cleaning flux residue and remains, solder reflow and more. ITW EAE works with the world’s leading semiconductor manufacturers in developing equipment that addresses evolving technical challenges while also meeting the need for higher throughput, yield, and performance.
For more information visit https://www.itweae.com.