Tech Core PVA

• Booth: L0025

Overview

Tech Core PVA invents and manufactures performance PVA products for critical-cleaning applications and processes in the Semiconductor and Disk Drive.

Leveraging 60+ years of combined experience in PVA engineering, design and manufacturing, our team has brought to market advanced PVA technologies that are proven to extend brush life, improve particulate elimination and dramatically increase production yields.

  Press Releases

• A Revolution in Eco Friendly Wafer Cleaning Technology- (Aug 28, 2023)
  Introducing the Tech Core TC-23™ Eco Friendly PVA Cleaning Brush.  A Revolution in Wafer Cleaning Technology.

  With the TC-23™, you'll witness a significant reduction in contaminating particles resulting in less break-in time, minimized wafer defects and significantly increased wafer production yields. 

  By enclosing the PVA within plastic rails and limiting water contact to the cleaning nodules, water can only exit directly through these nodules, enhancing on the cleaning process while purging particles.  Internal channels within the nodules create a direct and unobstructed pathway for water to reach the tip of the nodule, where it interfaces with the wafer.

  The optimized water distribution delivers even cleaning performance and superior purging of contaminants. The design of the patent pending TC-23™ reduces DI water usage up to 40% and uses 70% less PVA than standard brushes. The TC-23 core is crafted with non-toxic CPVC and uses RFID technology for a more efficient and environmentally friendly approach to manufacturing.

  This unique design surpasses any other brush currently available in the market.  Visit us at booth L0025.  Learn more at www.techcorepva.com

• Meet the Future of ECO Friendly PVA Wafer Cleaning Brushes-TC-23™ (Aug 31, 2023)

  Hailed as the game changer in wafer cleaning technology, the TC-23™ PVA Eco Brush System will be debuting to the Asian market at SEMICON TAIWAN September 6-8, 2023.
  
  The TC-23™ PVA Eco Brush System makes dramatic strides towards meeting increasing demands for environmentally friendly and efficient PVA brushes for Semiconductor manufacturers.
  
  With its advanced PVA formulation, modified core, innovative water flow design result in even distribution, the TC_23™ has proven to increase yields by up to 70%, uses less PVA, reduces DI Water usage by up to 40% and shortens the break in time of the brush. Finally, the TC-23™ is the first brush to offer RFID traceability.
  
  Visit booth L0025 SEMICON TAIWAN to witness the future of wafer cleaning! Don't miss the opportunity to experience TC-23™ firsthand and revolutionize your fabrication process.

  Products