Introducing heat treatment equipment for following material
- φ8 inch SiC wafer (Activation, oxynitriding and contact annealing)
- GaN wafer
- IGBT wafer
- MEMS
Showing very excellent performance of temperature uniformity for following process
- Heat treatment for latest packaging technology, "FO-PLP" 最先進的熱處理封裝製程「FO-PLP」
- Wet-oxidation at low temperature process for "VCSEL" 低溫濕製程「VCSEL」
Demonstration test is available. So please come to our booth P5223 and ask us it.
JTEKT THERMO SYSTEM English website : https://www.jtektthermos.com/