New Smart Technology Co., Ltd

The trend of semiconductor advanced manufacturing process is to develop the wafer towards multi-layer stacking, so that the size of the wafer is smaller, more power-efficient, and more powerful; therefore, the evolution of 3D stacking technology and heterogeneous packaging technology will drive the development of automatic optical inspection technology towards more precise inspection.

3D packaging has become the focus of TSMC, Intel and Samsung. TSMC is engaged in advanced process wafer-level internal packaging, and the major packaging and testing houses in Taiwan will also focus on system-level packaging (SiP) and integrated antenna package (AiP) for R&D. In addition, various 5G cell phones are expected to use AnyLayer HDI and Substrate-Link PCB (SLP). Due to the huge amount of data to be handled, the focus is on energy and heat dissipation, so the high speed computing products use 2.5D and 3D large integrated package structure to enhance the speed and quality of signal transmission.

Mainly by regrouping class carrier board, silicon carrier board and RDL as a bridge for communication between wafers, the line spacing can be reduced by 4~5 times compared to traditional substrate. The reduction of line width and line spacing can effectively increase the footprint of the package and shorten the signal delay time to improve the overall system performance, and there will be a certain market demand for AOI inspection devices with line width and line diameter smaller than um.

NST 3D Metrology Function performs sample height and coplanarity measurement for C2&C4 Wafer Bumping and 2.5D Wire Bonding process by using 3D High Resolution Optical System to ensure consistent Bump height and stable Bump and Substrate bonding.

Features

• High-speed 3D Full Bump height measurement
• Bump Diameter
• Bump Height
• 3D multi-functional measurement system
• Support high aspect ratio products (AR 1:7) μBump tall pillar 3D measurement
• Easy-to-use visualization of various engineering analyses
• Contour map
• Contour map
• 3D profile
• Auto switching multi-magnification microscopic inspection system
• Nanoscale Auto Focus System
• Large-size chip alignment system (Multi-View)
• Recipe off-line editing function
• Multi-Thread image comparison algorithm system
• Visual measurement system to detect key dimensions by image measurement
• Import CAD to save Recipe creation time
• Automatic calibration and inspection system
• Customized report output
• Fast loading and unloading (<10sec)

Optional

• AI Function
• OCR function
• Review /re- judgment system
• EDC function
• Real-time process status display
• SECS/GEM compatible
• SEMI S2 security certified
• High warpage solution

Critical defect

• Residue
• Particle
• Damage
• Open / Short
• Scratch

OSD-T200 AOI inspection machine uses a high precision optical image inspection system to inspect the surface condition of the material, supplemented by image processing technology, to detect defects such as foreign objects or abnormal patterns on the surface (internal) of the material.

The defective images are then transferred to our Multi-Thread comparative algorithm system and AI analysis system, and fed back to the pre-processing process for full automatic adjustment of the relevant process parameters.

Features

• Auto switching multi-magnification microscopic inspection system
• Nanoscale Auto Focus System
• Large-size chip alignment system (Multi-View)
• Recipe off-line editing function
• Multi-Thread image comparison algorithm system
• Visual measurement system to detect key dimensions by image measurement
• Import CAD to save Recipe creation time
• Automatic calibration and inspection system
• Customized report output
• Fast loading and unloading (<10sec)

Option

• AI Function
• OCR Function
• Review /re- judgment system
• EDC Function
• Real Time Process Status Display
• SECS/GEM Compatible
• SEMI S2 security certified
• Handheld Barcode Reader/ RFID Function
• High Warpage Solution

Critical defect

NST AOI Customized Response

In the past five years, the global electronics industry has focused on AR/VR (virtual reality) related product development as a key project, and the quality yield control of the key components of the derived products is regarded as the first priority, and the AOI equipment for glass inspection of AV/VR glasses and displays is a key development project based on years of experience in optical inspection components and camera module manufacturing and inspection. OFI-100 can wafer & AR/IR coating inspection for the process need to detect the trapped (dot, scratch, dirt, film crack, film line abnormalities, plating the same surface, surface foreign matter and edge chipping, etc. using NST AOI OFI-100 to effectively block and combined with the NST AI system can be under the line of multiple categories of analysis and determination. Can effectively grasp the process anomaly key and feedback.

NST has been engaged in smart manufacturing for many years, and has a track record in CCM, PCB and semiconductor industries. In the semiconductor industry, there are many old equipment or manual equipment that need to be upgraded. Integrate the planned equipment and use NST RCM system to program the automation script to achieve remote control and information flow transmission.

NST RCM system can carry out remote automatic control and real-time monitoring of equipment status in accordance with field operation flow to prevent personnel from interfering with operation errors, and can eliminate equipment abnormalities in a timely manner to improve equipment crop rate in accordance with field requirements, and at the same time, NST RCM system can support SEC/GEM with factory EAP system requirements for serial integration, and serial data can be uploaded to NST IDAS (Inspection Date Analysis System) system for The data can be uploaded to NST IDAS (Inspection Date Analysis system) system for integration and output of related charts and maps according to the process yield requirements, effectively providing the factory with more intuitive monitoring and cross-comparison of yield and capacity.

The system supports custom I/O formats which is convenient for docking with various AOIs, and can be imported into existing production lines directly.

Features of AIRS:

1. Support customer-defined I/O formats, easy to integrate into existing production line processes.

2. Automatically select AI recipe function to reduce the manual work of tedious operations.

3. Output the AI re-judgment report to facilitate the management of rejudgment results.

4. Output Wafer Map, visualize AI re-judgment results, and count yield changes.

Import benefits:

1. Reduce the overkill rate: AIRS can re-judgment the products judged to be defective by AOI, avoid the overkill rate caused by over-judgment, and improve the pass rate of the product.

2. Improve judgment accuracy: The AIRS uses artificial intelligence technology for re-judgment which can continuously learn and optimize the judgment model to improve the precision and accuracy of judgment.

NST AI ADC is a product developed using artificial intelligence technology which can help customers automatically classify defects in the semiconductor production process, thereby improving production efficiency and product quality.

Advantages of NST AI ADC:

1. Efficient automation: The ADC system can automatically complete defect classification, greatly reducing the time and cost of manual inspection and judgment.

2. Classification reports: The system can generate detailed defect classification reports so that production line managers can understand the types, quantities and locations of defects on the production line.

3. Visualized data: The system can display the collected data in a graphical way, and the production line managers can quickly understand the occurrence trend, type and incidence of defects through data charts and other information.

Benefit:

1. Reduce labor costs: Compared with traditional manual inspection, the AI ADC can reduce human input and save inspection costs.

2. Optimize process parameters: Through the analysis results of automatic defect classification, engineers can find problems in the manufacturing process, and then optimize process parameters, reduce the risk of defects, and improve product yield.