The trend of semiconductor advanced manufacturing process is to develop the wafer towards multi-layer stacking, so that the size of the wafer is smaller, more power-efficient, and more powerful; therefore, the evolution of 3D stacking technology and heterogeneous packaging technology will drive the development of automatic optical inspection technology towards more precise inspection.
3D packaging has become the focus of TSMC, Intel and Samsung. TSMC is engaged in advanced process wafer-level internal packaging, and the major packaging and testing houses in Taiwan will also focus on system-level packaging (SiP) and integrated antenna package (AiP) for R&D. In addition, various 5G cell phones are expected to use AnyLayer HDI and Substrate-Link PCB (SLP). Due to the huge amount of data to be handled, the focus is on energy and heat dissipation, so the high speed computing products use 2.5D and 3D large integrated package structure to enhance the speed and quality of signal transmission.
Mainly by regrouping class carrier board, silicon carrier board and RDL as a bridge for communication between wafers, the line spacing can be reduced by 4~5 times compared to traditional substrate. The reduction of line width and line spacing can effectively increase the footprint of the package and shorten the signal delay time to improve the overall system performance, and there will be a certain market demand for AOI inspection devices with line width and line diameter smaller than um.
NST 3D Metrology Function performs sample height and coplanarity measurement for C2&C4 Wafer Bumping and 2.5D Wire Bonding process by using 3D High Resolution Optical System to ensure consistent Bump height and stable Bump and Substrate bonding.
Features
- High-speed 3D Full Bump height measurement
- Bump Diameter
- Bump Height
- 3D multi-functional measurement system
- Support high aspect ratio products (AR 1:7) μBump tall pillar 3D measurement
- Easy-to-use visualization of various engineering analyses
- Contour map
- Contour map
- 3D profile
- Auto switching multi-magnification microscopic inspection system
- Nanoscale Auto Focus System
- Large-size chip alignment system (Multi-View)
- Recipe off-line editing function
- Multi-Thread image comparison algorithm system
- Visual measurement system to detect key dimensions by image measurement
- Import CAD to save Recipe creation time
- Automatic calibration and inspection system
- Customized report output
- Fast loading and unloading (<10sec)
Optional
- AI Function
- OCR function
- Review /re- judgment system
- EDC function
- Real-time process status display
- SECS/GEM compatible
- SEMI S2 security certified
- High warpage solution
Critical defect
- Residue
- Particle
- Damage
- Open / Short
- Scratch