SUSS MicroTec (Taiwan) Co., Ltd.

Hsin-Chu City,  Taiwan
  • Booth: N0376

Welocome to SUSS MicroTec's booth No. 376


The SUSS MicroTec Group is a leading supplier of equipment and process solutions for microstructuring applications with more than sixty years of engineering experience. 

Our portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components.

The production of memory chips, cameras for mobile phones or tire pressure sensors – the equipment solutions of SUSS MicroTec are applied within a wide variety of manufacturing processes for applications of daily or industrial use. Customers in the semiconductor industry and related markets like Advanced Packaging, MEMS and LED appreciate our comprehensive experience in wafer processing. This makes us a valuable partner for high-volume production as well as for research and development.


  • Lithography Solution - Coater & Developer
    ACS300 Gen3 / ACS300 Gen2 / ACS200 Gen3 - Coater & Developer Comprehensive Lithography Solution for high-volume manufacturing (HVM) 300mm / 200mm / 150mm...

  • Production Spin Coat / Develop Cluster for Wafer Level - Meeting Your Needs with Comprehensive Coating and Developing Solutions

    The ACS300 Gen3 / ACS300 Gen2 / ACS200 Gen3  is a modular cluster system designed to meet manufacturers' needs for clean, reliable, high-throughput and modular photolithography processing multi size wafers. Different wafer sizes can be processed parallel or sequential without any mechanical changeover. SUSS systems can be equipped with process modules for HMDS vapor priming, spin coating, spray coating, aqueous or solvent based developing, baking and cooling. It masters thin and thick resist applications as well as photosensitive polymers like polyimide, PBO and Cyclotene (BCB).

    MicroTec spin coaters and spray coaters have become synonymous with premium performance, ease of use, flexibility and enhanced coating mastery. With a complete line of compact and user-friendly resist coating equipment from economic low-volume laboratory tools to high-end production systems up to 300 mm SUSS MicroTec coaters and developers enable the formation of resist layers ranging from below 1 µm to over 500 µm.

    SUSS MicroTec Coater Developer addresses all requirements for sophisticated resist processing and the 3D-Integration and Wafer Level Packaging technology in particular.

    Allows flexible production planning from R&D/pilot production to the volume production stage. A small footprint configuration comes with 2 load port modules directly attached to the basic frame which guarantees for optimum cost-of-ownership. With a separate EFEM the machine can be equipped with 4 load port modules. It is equipped a high-precision dual arm robot and camera based centering.

    Coater Developer Main Features

     Modular Robust Design

    • Configurable hardware and software
    • Choice of base platforms for many applications and substrates
    • Choice of dispense system
    • Connectivity to other processing equipment

    Optimal Process Control

    • Flexible process control with flow editor
    • SUSS Dispense system closed loop control
    • Automated chuck and nozzle clean
    • Open bowl Coater for PI / Gyrest coater for PR
    • Integration in clean and inert enclosure
    • New Hot Plate Performance

    Ease of Use

    • Automated scheduler
    • Support Parallel Flow Process
    • Flexible recipe editor
    • Data Logging system
    • User level controlled Access