Great Domain Enterprise Co., Ltd.

1. Simultaneous press and sintering multiple chips by special elastic head ➡ Improve Productivity
Heat and pressurize after wrapping multiple chips on the board with a special elastic head.
Multi‐bonding on the surface of □ 150mm to □200mm is possible, contributing to productivity
improvement. ISO‐bonder's new mold employs a rapid heating structure, which enables to heat from
room temperature to 300 degree C in 200 seconds.

2. Pressing Chip and sinter material with a special elastic head ➡ Improve Quality

The chips are wrapped with a special elastic head and then heated and pressurized.

Suppresses over‐pressurization of some chips and chip misalignment, contributing to quality

improvement. The elastic head presses fillet part, adverse impact on workpiece on subsequent process

can be reduced.
3. Vacuum function prevents oxidation ➡ Improve Quality
Vacuuming is performed before heating and released after press/heating, preventing oxidation of
product. The process withholds from adverse impact on workpiece on subsequent process.