AEM Singapore Pte. Ltd.

AEM’s ATOM IC Test Handler can handle most standard semiconductor packages ranging in size from 6mm to 55mm. The system can accommodate most BGA, LGA, QFP, QFN, PLCC, POP, DIP, and PGA devices and many others. Smaller sizes may be handled in many cases.

The system has two binning modes:

Mode 1 (SORT, 1 IN 2 OUT) utilizes one input tray with devices to be tested, and two empty output trays. - The parts are picked from the input tray, presented to the contactor, and then sorted to the appropriate output tray based on the binning signal sent by the tester.

Mode 2 (ALL TEST, 3 INPUT) utilizes up to 3 input trays, all containing devices to be tested. – Each device is tested and returned to the same location in the same tray from which it was taken.

The system also has a device precising option. If selected, the system can precise the part to insertion into the test socket. Precising is used in cases where the device tray has insufficient precision and/or the test socket has insufficient lead-in to allow the device to be dropped correctly and accurately. Device rotation (optional) can also be performed.

The system utilizes a simple digital input/output logic methodology to interface with a test system. RS232 and GPIB communication options are also available.

The system is flexible, with options to be used as a table-top operation, or on a cart, to interface with most standard ATE test equipment (test heads).

The system can be used with several thermal control systems to enable ATC and hot/cold testing. The temperature range of the test is determined by the device to be tested, its power dissipation, and the type of thermal control system used.

NESTEK PIN can be produced with barrel outer diameter of ø0.15~7.0 and length of 1.5~93.0mm.

It is used for O/S (Open, Short) test, function test, and SLT test of various semiconductor packages including BGA, LGA, QFN, QFP, as well as various types of inspection of various camera modules and display modules.

Discover the limitless potential of AEM's HD platforms, equipped with a flexible architecture that supports an impressive range of features. With up to 2048 digital pins and 256 1A DPS in our compact air-cooled 10-slot system, you can unlock unparalleled testing capabilities.

Experience the freedom of customization with our modular FPGA-based instruments. These instruments can be effortlessly integrated into any slot, providing a cost-effective solution for digital, mixed signal, or application-specific testing needs. Plus, with our future-proof roadmap of application-specific enhancements, you can stay ahead of the curve.

We take performance seriously, which is why our instruments are optimized with a suite of calibration programs. This ensures impeccable timing and level accuracy, empowering you to achieve precise results every time.

Our software tools align with industry standards for factory automation, data logging, and pattern conversion. Built on a proven multi-threading architecture, they support parallel testing of over 256 sites with minimal overhead. Seamlessly integrate our platforms into your test cell with a range of manipulators available for docking to probers and handlers.

Looking for application-specific solutions? AEM offers CMOS Image Sensors and RF SOCs test solutions tailored to meet your unique requirements. Visit our booth to explore the full potential of our platform and see firsthand how it can elevate your testing capabilities.

Don't miss out on the opportunity to enhance your design, characterization, and manufacturing processes. Experience the cost-effective ATE test solution that AEM's HD platforms provide, from wafer sort to final test. Join us and revolutionize your testing experience.