Kao Corporation

Tokyo,  Tokyo 
Japan
https://chemical.kao.com/global/electronics/
  • Booth: I3210

Kao's wide range of front-end and back-end chemicals

Overview

Not only famous in consumer product business, Kao's chemical business contributes to create a future of industry and a sustainability of society.

Harnessing its interface control technologies, Kao helps to contribute to the realization of environmentally friendly, cutting-edge products through the provision of a range of polishing agents, cleaners, and additives.

Find out about our chemicals for CMP slurry, advanced packaging (tape residue or resist remover for TBDB process), and power electronics.

  Products

  • TBDB(temporary bonding/debonding) cleaner
    Kao's TBDB cleaners are suitable for improving yield and reliability for various tapes and resist/coating materials used for TBDB....

    • Kao's TBDB cleaners are suitable for improving yield and reliability for various tapes and resist/coating materials used for TBDB.

    Maintaining the balance of removing TBDB material and low damage to peripheral resins and metals, Kao's NMP-free TBDB cleaners could contribute to advanced packaging and power electronics.

  • Ceria CMP slurry "LUNAFLAT"
    "LUNAFLAT" is Kao's brand new cerium oxide based CMP slurry for oxide planarization....

    • With Kao's proprietary engineered cerium oxide abrasive and surface control chemicals, our ceria CMP slurry "LUNAFLAT" contributes to high speed precision planarization process of oxide surface.
  • Power semiconductor chemicals
    Kao offers various remover chemicals for power semiconductor front-end and back-end assembly....

    • Kao offers wide range of power semiconductor chemicals from front-end resist/coating removal chemicals to back-end assembly cleaning chemicals.

Categories

301 Materials, Chemicals & Solids
  • Cleaning Chemicals; Solvents; Strippers
  • Other Specialty Chemicals
  • Photo Resist; Developers & Ancillaries (incl. Adhesion promoter (HMDS); Primer; Anti-Reflective Coat
    • 307 Materials, Process
  • CMP; Grind; Lap; Polish; Abrasive materials
    • Loading ...

    :
    :


    Legend
    Available Timeslot
    Scheduled Appointment
    Personal Appointments
    Appointment Request
    Blocked Timeslot
    Restricted Timeslot
    Cancelled
    Declined