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ORICUS SEMICON SOLUTIONS PTE. LTD.

Singapore,  Singapore
https://oricus-semicon.com
  • Booth: P5920

Standard & Customised Tooling Solutions for Assembly & Test

Overview

Oricus Semicon Solutions is an innovative Semiconductor Backend Tools manufacturing company who, with extensive process and application know-how, craft mission critical bespoke tooling solutions for the global Semiconductor Assembly and Test industry. From one-off specials to large scale production, our R&D capabilities, precision manufacturing experience and problem-solving capabilities are impeccable. With a passion for engineering and customer oriented service; we deliver price competitive precision Semiconductor Tooling solutions to a global market with a local presence. 

We excel in special applications, with craftsmanship combining with the latest in manufacturing technology to produce micro precision tooling. Oricus can Design and Manufacture either one-offs or high volume orders to your unique specifications, from High Temperature resistant tools for Power Devices to complex tools for 3D Advanced Packaging.

Our Sales and R&D teams of seasoned Semiconductor Assembly and Test industry professionals will study your chip and package requirements and offer effective and competitive tooling solutions that will work right out of the box. 

Beginning with incoming material inspection and following through the production process, our facilities that are ISO9001:2015 and ISO14001:2015 certified operates stringent Quality Assurance programmes which has won the trust and respect of customers worldwide. Our Quality control facilities include the Material Testing laboratory, a comprehensive dimensional test procedure and tool performance testing center for tool performance testing and final product inspection. 

Pursuant to the provisions of the European Regulation (EC) 1907/2006 concerning Registration, Evaluation, Authorization and Restriction of Chemicals (REACH), and European Parliament 2011/65/EU concerning Restriction of Hazardous Substances (RoHS), Oricus has been taking all necessary measures to comply with REACH and RoHS provisions. We have also adopted the OECD Due Diligence Guidance for Responsible Supply Chains of Minerals from Conflict Affected and High Risk Areas. 


  Products

  • Die Attach - Rubber Tips
    Rubber Tips are a line of replaceable Pick Up Tools that can cater to a wide range of different applications. One of the main benefits its ability to absorb the impact that the Pick and Place process may have on the die or device....

  • Oricus’s Rubber tips come in NBR (Nitrile Rubber), HPR (High Performance Rubber), UPR (Ultra Performance Rubber), and CR (Composite Rubber) materials. All our rubber materials are developed and manufactured in-house specially for our Pick Up Tools. 

    It can be made in Round, Square, Rectangular, and Custom designed outer profiles. Various tip designs such as Flat, Vacuum Relief, Groove, Multi-Hole, and Side Contact can be made to suit your particular die or device.

  • Die Attach - Rubber Tip Holders
    Rubber Tip Holders are the intermediary that secures the Rubber Tip to your machine’s tool holder and it plays an instrumental role in a successful Rubber Tips programme....

  • We manufacture Common holders, Tri-Lock holders, Compression holders, and Magnetic Holders that are designed to fit our Rubber Tips for various process and application requirements.

    For optimal performance, our Rubber Tip Holders are the best match for our Rubber Tipsthat are available in Round, Square, Rectangular, and Custom designed outer profiles and tip designs such as Flat, Vacuum Relief, Groove, Multi-Hole, and Side Contact.

  • Die Attach - Pick Up Tools
    The family of Pick Up Tools designed and manufactured by Oricus consists of Tungsten Carbide Tools, Hybrid Pick Tools, Alloy/Superalloy Steels Tools, and Engineering Plastics Tools....

  • Tungsten Carbide Pick Up Tools are the toughest tools in our product lineup. We recommend the use of Tungsten Carbide Tools for the most demanding Pick and Place applications with high requirements for strength, temperature, and wear resistance.

    Hybrid Pickup Tools are typically made of 2 materials, Alloy Steel for the tool body and Tungsten Carbide for the tool tip. We offer different joint technologies for the Metal-Carbide bond, which is dependent on your application requirements. Hybrid Tools offer the performance of Tungsten Carbide tools at a modesty higher price point of Alloy Steel tools.

    Alloy Steel Pick Up Tools are tools made from Tool Steels, Stainless Steels, and Superalloys. We select Alloy Steels for tools that require high bond force, high-temperature resistance, and high resistance to wear.

    Non Ferrous Tools are specifically designed for thin die applications with die thickness ≤0.1mm which are used for bonded devices deployed in harsh environments with high thermal transfer and heat distribution requirements.

    Engineering Plastic (EP) Pick Up Tools are a family of polymeric Pickup Tools made primarily from materials such POM, PI, PAI, and PEI compounds.

    Material Grades and Tool Designs are extensively researched and carefully developed by our R&D and Design team to ensure industry leading performance at a competitive price point.

  • Die Attach - Ejector Systems
    Our Ejection Systems product line is made up of Ejector Needles, Needle Holders and Pepper Pots....

  • Our Ejector Needles Product Line is made up of Standard Ejector Needles, Twin Ejector Needles and Quad Ejector Needles. 

    Standard Needles are used to eject singulated dies from the wafer tape. Ejection Systems Needle designs such as Piece Through or Non-Piece Through are available, depending on your particular application.

    Twin Needles are designed for small elongated die applications (≤0.7mmx1.0mm) to reduce the propensity of tilted dies during the ejection process. For elongated dies, single tip needles with one point of contact will create a pivot action and cause the die to see-saw when being ejected.

    Quad Needles are designed for small die applications (≤1.0mm x 1.0mm) to reduce the propensity of tilted dies during the ejection process, where using multiple Standard Needles poses a space constraint. As compared to the single needle with spherical radius concept, Quad Needles greatly increases the stability and performance of the small die ejection process with minimum die tilt.

    Needle Holders are a critical interface component between the machine and the rest of the components of a die ejection system. Typically, Needle Holders are used in combination with Ejector Needles and Pepper Pots.

    Pepper Pots are designed to ensure that there is sufficient downwards vacuum suction force on the wafer tape to facilitate a smooth die ejection process. The layout and number of vacuum holes plays an important role for the target die and neighboring dies to be processed optimally.

  • Die Attach - Adhesive Systems
    Our Adhesive Systems lineup comprises of Dispensing Tools, Stamping Tools, Spanker Tools and Flux Systems. Each of these tools play a crucial role in the Adhesive Dispensing process....

  • Adhesive Dispensing Tools consists of primarily Adhesive Dispensing Nozzles and Adhesive Stamping Tools. Both tools are used for the application of adhesives to leadframes or substrates albeit with different adhesive delivery methods.

    Adhesive Dispensing Nozzles are designed with Single Tubing or Multi Tubing according to the process, application or pattern requirements. Single Tubing Adhesive Dispensing Nozzles are suited for dotting micro amounts of adhesives for small die sizes or used as an Adhesive Writing Pen. Multi Tubing designs allows for better throughput with a higher volume of adhesive delivery within the same timeframe.

    Adhesive Stamping Tool's primary function is to transfer adhesives from the Flux Plate or Rotating Cup onto the leadframe or substrate.

    Flux Systems comprises of two main components, Flux Plates and Blade Scrapers. Flux Plate’s primary function is to hold the flux within the reservoir while the stamping tool dips into the flux for transfer to the leadframe or substrate.

    The precision of the Flux Plates and Blade Scrapers are of significant importance in the implementation of a successful adhesive stamping process.

    Oricus’s Adhesive Systems are designed and manufactured according to your selected adhesive’s viscosity and thixotropy specifications to ensure optimal dispensing performance.

  • Bond Test - Die & Ball Shear Tools
    Bond Testing and Inspection refers to the tests performed after the Die Attach and/or Wire Bond process to determine the integrity and reliability of the bonded integrated circuits....

  • Visual Test and Inspection

    Visual techniques using Automated Optical Inspection equipment are used to verify that proper Ball Bonds and Wedge Bons have been formed according to process design. In addition, the Visual Test and Inspection process also verifies that the bonds have been properly located in relation to the bond pads and the fingers of the leadframe and/or substrate.

    Die Shear

    Die Shear Testing, alternatively known as Package Shear Testing is a shear test that utilizes high force to determine the strength of adhesion between the bonded die and the underlying substrate. It is an ideal method for measuring glue, solder and sintered silver bonded areas. Die Shear Testing is a widely implemented method that is ideal for Adhesive, Solder and silver Sintered bonds.

    Die Shear Tests can be performed with a few grams of force up to 1000 kilograms of force. Die Shear Tests are also suitable for Ultra Thin Dies and Flip Chip Ball Grid Arrays.

    Our self aligning Die Shear Tools can help eliminate issues with cracked dies during test.

    Ball Shear Test

    Ball Shear Test is a process for the evaluation of a Ball Bond’s quality. Data retrieved post Ball Shear Testing illustrates the intermetallic formation and the coverage of the bonds.

    Test data from Ball Shear Testing such as the Bond Strength and Failure Modes are used to evaluate the quality of a Ball Bond.