Scientech Corporation

辛耘企業於2002年開始投入批次式及單晶片式濕式製程設備研發製造，已經獲得國內外客戶採用與肯定。目前辛耘擁有 5,000 m2生產製造廠房，同時擁有 Class 10 等級無塵室服務客戶製程需求驗證平台。產品包含手動 / 半自動 / 全自動的批次式及單晶片製程設備提供客戶2”~ 12”製程應用需求。特有的 cassette type / boat type / cassette-less type 技術提供半導體晶圓、藍寶石、玻璃、LED、太陽能晶圓、薄化晶圓等應用。另外，辛耘企業擁有的專利產品”Advantech Dry”提供客戶各種關鍵旋乾的製程應用。
辛耘新開發Sirius系列設備，結合批次式及單晶片式濕製程優點並擁有特殊垂直高壓噴洗技術提供製程彈性。應用領域含括:

Sirius Series濕製程設備:

• Applications :
  • Semiconductor FEOL & BEOL
  • 2.5D/3D IC, Advanced packaging, Bumping, Si Photonics
  • Compound SEMI : SiC / GaN / GaAs / InP / ...
  • MEMS
  • LED / mini LED / micro LED
  • Panel, Carrier, Substrate
• Process: 
  • Stripper : Dry-Film / Thick Film Removal
  • Metal Lift-Off

辛耘公司的特色：

• 客製化軟硬體設計服務
• 專業與快速的售後服務
• 安全設計兼具簡易操作
• 主動協助客戶快速量產

辛耘企業於2002年開始投入批次式及單晶片式濕式製程設備研發製造，已經獲得國內外客戶採用與肯定。目前辛耘擁有 5,000 m2生產製造廠房，同時擁有 Class 10 等級無塵室服務客戶製程需求驗證平台。產品包含手動 / 半自動 / 全自動的批次式及單晶片製程設備提供客戶2”~12”製程應用需求。特有的 cassette type / boat type / cassette-less type 技術提供半導體晶圓、藍寶石、玻璃、LED、太陽能晶圓、薄化晶圓等應用。另外，辛耘企業擁有的專利產品”Advantech Dry”提供客戶各種關鍵旋乾的製程應用，應用領域包括:

Single Wafer單晶片式濕製程設備 ( Polar Series ):

• Applications :
  • Semiconductor FEOL & BEOL
  • 2.5D/3D IC, Advanced packaging, Bumping, Si Photonics
  • Compound SEMI : SiC / GaN / GaAs / InP / ...
  • MEMS 
  • LED / mini LED / micro LED 
• Process:
  • Etch : UBM, Solder, Metal, Oxide, Nitride Removal, Polymer Removal, Immersion & Spin Etch
  • Clean : Pre-Clean, Post-Clean, Final-Clean, Scrubber, Flux Clean, Frame Clean, Mask Clean, Ozone Clean..
  • Stripper : PR Stripper, Polymer Removal (EKC, IPA, NMP, SPM, DMSO, Non-DMSO,..)

Wet Bench批次式濕製程設備 ( WSE Series):

• Applications :
  • Semiconductor FEOL & BEOL, 
  • 2.5D/3D IC, Advanced packaging, Bumping, Si Photonics
  • Compound SEMI : SiC / GaN / GaAs / InP / ...
  • MEMS 
  • LED / mini LED / micro LED 
• Process :
  • Etch : UBM, Solder, Metal, Oxide, Nitride Removal, Polymer Removal, Immersion & Spin Etch
  • Clean : Pre-Clean, Post-Clean, Middle-Clean, Scrubber, Flux Clean, Frame Clean, Mask Clean, Ozone Clean.
  • Stripper : PR Stripper, Polymer Removal (EKC, IPA, NMP, SPM, DMSO, Non-DMSO,..)
  • Clean: Pre-clean, Post clean, Flux clean
  • Plating: Electro-less plate (Zn/Ni/Au), Electric plating (Cu/Ni/SnAg)

辛耘公司的特色：

• 客製化軟硬體設計服務
• 專業與快速的售後服務
• 安全設計兼具簡易操作

辛耘企業於2015年開始投入暫時性貼合設備研發製造，已經獲得國內外重要客戶採用與肯定。目前辛耘擁有 5,000 m2生產製造廠房，同時擁有 Class 10 等級無塵室服務客戶製程驗證平台。產品包含手動/半自動/全自動的暫時性貼合、剝離、解離層成型及載具清洗回收系統，提供客戶6”~12”製程應用需求。

TBDB暫時性貼合/剝離設備 (Pyxis series):

• Applications :
  • Wafer Thinning Process for IGBT & Power Device
  • 2.5D/3D IC, Advanced packaging, Bumping, Si Photonics
  • mini LED / micro LED
• Process:
  • Temporary Bond : UV Curing, Thermal Bond 
  • Temporary Debond : Frame De-bond ,Taiko De-bond, All De-bond applications
  • Release Layer Formation System
  • Carrier (Glass) Recycling System

辛耘公司的特色：

• 客製化軟硬體設計服務
• 專業與快速的售後服務
• 安全設計兼具簡易操作
• 主動協助客戶快速量產

Scientech provides 4” & 6” SiC wafer reclaim service by professional reclaim technique, new equipment/ utility and advanced process technology for high quality SiC substrates.

Process Capability

• Grinding
  • Surface roughness, Ra: ~1nm
  • TTV: < 3um
• Polishing
  • Surface roughness, Ra: ~1A
• Cleaning
  • Surface cleanness, LPD <0.3um
  • Surface Metal < 1E10 Atoms/cm2 (By ICP-MS) 
• Inspection(Geometry/ Defect)
  • FRT/ Candela

Scientech provides 12” wafer reclaim service and 12” test wafer.  Our team is formed by professional reclaim technique, new equipment/ utility and advanced process technology for 7/5 nm IC design rules.  Our customers are covered in major Logic, DRAM Fab, equipment, and research lab worldwide. 

Our Mission：

•  Minimum Removal Rate
•  Maximum Return Rate
•  Minimum Return Time
•  Robust Quality System
•  Accurate Tracing System
•  Quick Respond System

Mask / Reticle

• Mask Dry Etcher, CD / Overlay Metrology, E-beam Writer, Reticle Cassette

Lithography Process

• Stepper, Coater / Developer, Mercury Lamp

Etch Process

• Dry Etcher, Plasma Cleaning / Descum, End Point Detection

Thin Film & Plating Process

• Electro-Plating System, PECVD, PVD, CVD, IBD, Pulsed Laser Deposition

Diffusion & Thermal Process

• High Pressure Annealing Systems, RTP

Metrology & Inspection

• Optical / Stylus Profiler, Standards, 3D X-Ray Microscopy, Isolation Systems, Stress Meter

Back-end Process

• Ball Mounter, Reflow, EMI Tape, SMT Scope, Paste & Sheet, AOI, Tri-temp Test Handlers

Sub-Systems & Others

• Laser Marker, Power Supply, RF Generator, Robot, EFEM, Pressure Sensor, Valves, Metal Cassette, Magazine, KVM, ESD Solution, Optical Filter, O2 Analyzer 

Flat Panel Display

• Dry Etch, PECVD, Annealing Furnace, PI Curing Furnace, PVD, Mask / Cassette Cleaner, Optical / Stylus Profiler, AP Plasma Clean

Battery

• Cell Stacking, Degas, X-ray inspection, Secondary Battery Cell Automation Production Tools 

Analytical Inst.

• Particle Sizer, Pre-Treatment, Element Analyzer