Develop the chips of the future with SET Flip-Chip Bonders.
Overview
Founded in 1975, based in France, SET is a world leading supplier of High Accuracy Flip-Chip Bonders - Chip-to-Chip and Chip-to-Wafer - and versatile Nanoimprint Lithography (NIL) solutions.
With equipment installed worldwide, SET is globally renowned for the unsurpassed accuracy and the flexibility of its Flip-Chip Bonders.
Ranging from manual loading to fully automated version, our machines adapt to all main bonding techniques: fluxless reflow, thermo-compression, adhesive joining compression, thermosonic…
SET offers a comprehensive product portfolio of Flip-Chip Bonders for fast growing markets and serves its clients through a global network of representatives (DKSH in Taiwan) and in-depth customer trainings.