Production Spin Coat / Develop Cluster for Wafer Level - Meeting Your Needs with Comprehensive Coating and Developing Solutions
The ACS300 Gen3 / ACS300 Gen2 / ACS200 Gen3 is a modular cluster system designed to meet manufacturers' needs for clean, reliable, high-throughput and modular photolithography processing multi size wafers. Different wafer sizes can be processed parallel or sequential without any mechanical changeover. SUSS systems can be equipped with process modules for HMDS vapor priming, spin coating, spray coating, aqueous or solvent based developing, baking and cooling. It masters thin and thick resist applications as well as photosensitive polymers like polyimide, PBO and Cyclotene (BCB).
MicroTec spin coaters and spray coaters have become synonymous with premium performance, ease of use, flexibility and enhanced coating mastery. With a complete line of compact and user-friendly resist coating equipment from economic low-volume laboratory tools to high-end production systems up to 300 mm SUSS MicroTec coaters and developers enable the formation of resist layers ranging from below 1 µm to over 500 µm.
SUSS MicroTec Coater Developer addresses all requirements for sophisticated resist processing and the 3D-Integration and Wafer Level Packaging technology in particular.
Allows flexible production planning from R&D/pilot production to the volume production stage. A small footprint configuration comes with 2 load port modules directly attached to the basic frame which guarantees for optimum cost-of-ownership. With a separate EFEM the machine can be equipped with 4 load port modules. It is equipped a high-precision dual arm robot and camera based centering.