Universal Instruments Corporation

Bringing efficiency and high productivity to advanced packaging assembly

The High-Speed Wafer Feeder is the world’s fastest rapid-exchange multi-die feeder. Combined with Universal’s FuzionSC™ Platform, it is the ultimate multi-die solution delivering highest utilization and efficiency for heterogeneous integration and EV power module assembly.

 
• 14 high-precision (sub-micron X,Y,Z) servo-driven pick heads
• High-precision (sub-micron X,Y,Z) servo-driven ejector
• 100% pre-pick vision and die alignment
• One-step “wafer-to-placement” handoff
• Synchronous wafer stretch and storage
• 16K cph dual wafer tables
• Up to 52 unique wafers types at once; 100mm, 
150mm, 200mm, 300mm

Performance and Value
• Maximum die size range with thinnest die
• 4X throughput improvement vs current generation
• Maximum panel size processing up to 635mm x 610mm

The High-Speed Wafer Feeder delivers value with the precision, performance, and flexibility to handle today’s most advanced applications while also enabling you for those to come

Universal Instruments’ FuzionSC™ Platform offers a complete solution to flip chip package applications by blending the strict accuracy demands of Semiconductor assembly with the speed and robustness of Universal’s Fuzion Platform. With the ability to handle all facets of flip-chip assembly, FuzionSC reduces operating and capital costs by maximizing throughput per floor space.

• Silicon/SMT, high-accuracy/high-speed assembly
• High accuracy: (±10µm, < 3µm placement repeatability)
• Dual- or single-beam, multiple-spindle heads
• Full range of die and component types and sizes
• Versatile substrate handling
• Broadest range of feeding platforms
• Low-maintenance, accurate over time
• Vision robustness recognition of pins or logic pads
• Stacking support (POP)
• Low-force capability