Zhengzhou Research Institute for Abrasives & Grinding Co., Ltd

Zhengzhou,  Henan 
China
http://www.zzsm.com
  • Booth: L1221

Welcome to our booth J2842

Overview

Founded in 1958, Zhengzhou Research Institute for Abrasive & Grinding is a unique comprehensive R&D unit for the abrasive industry in China. It is the center of technological research, development, information and consulting for the Chinese abrasive and superabrasive industries. It turned into a scientific and technological enterprise and joined China National Machinery Industry Corporation in 1999. It created the first crystal of diamond in 1963 and crystal of CBN in 1967. After that, a series of resin, metal, vitrified and electroplate bond superabrasive products were developed by our institute. In 1998, the National superhard Materials& Tools Engineering Research Center was established in the institue showing its leading position in the Chinese superabrasive industry.

Our main products for electronic industry are as followed:

Wafer Dicing blades

Metal & resin bond dicing blades for QFN and BGA

Back grinding wheels for silicon wafter

Chucks  

Ceramic block and dressing ring

Glass edge-grinding wheels

Grinding wheels for LED substrate

Diamond drills

Diamond slurry

We would like to make you satisfied with good quality and service.

  Products

  • 树脂切割刀 Resin Bond Dicing Baldes
    本系列切割刀为树脂结合剂产品，具有高质量，高效率，高锋利度的特性，适用于半导体封装，光学玻璃等产品切割。
    This series of blades have high quality, high efficiency and high sharpness.Use for semiconductor packaging materials, optical glass materials, etc....

    • 本款产品采用超硬磨料及树脂混合高温压制生产，结合剂具有弹性，对于磨料具备良好的保持能力。
    刀片本身具有较高的锋利度及良好的自锐性，在切割时具有良好的切割能力及切割效率。
    本系列产品适用于包括半导体封装器件，光学玻璃，陶瓷类，金属类等多种工件的切割加工。
    This series of blades are made of super-hard abrasive and resin evenly mixed by hot pressing process.The binder has certain elasticity and moderate binding ability to abrasive particles.
    The blade is characterized by high sharpness and self-sharpness, with high cutting efficiency and excellent cutting quality.
    It is suitable for precision slotting and cutting processing of various soft and hard materials.
    This series of baldes use for semiconductor packaging materials, optical glass materials, ceramic materials, magnetic materials and metal materials, etc.
  • 金属切割刀 Metal Bond Dicing Blades
    本系列产品具有高质量，高精度和长寿命的特点，适合高速切割及开槽工艺，适用于BGA/LGA, CSP, PCB 等切割。
    This series of blades have high-quality, high-accuracy and long-life. Suitable for high-speed, high-efficiency and precision slotting or cutting. Can use for BGA/LGA、CSP、PCB、MEMS、LED、SD etc....

    • 本系列刀片是将超硬磨料和金属粉末均匀混合后，采用粉末冶金工艺制备而成。

    该粘结剂耐磨性高，对磨粒结合能力强，保形性好，使用寿命长。

    适用于高速、高效、精密的开槽或切削。可用于BGA/LGA、CSP、PCB、MEMS、LED、SD、陶瓷、光学材料

    This series of blades are prepared by powder metallurgy process afteruniform mixing of superhard abrasive and metal powder. It has the advantages of diversified system and controllable performance.
    The bond has high wear resistance, strong binding ability to abrasive particles, good shape retention and long life.
    It is suitable for high-speed, high-efficiency and precision slotting or cutting. Can be use for BGA/LGA、CSP、PCB、MEMS、LED、SD、ceramics、optical materials
  • 电镀晶圆切割刀 Nickel Blades for Wafer Dicing
    采用电铸镍基结合剂工艺，具有超高强度，刀刃超薄，满足半导体晶圆窄街区的划切需求。适用于硅晶圆, 化合物半导体晶圆（GaAs、GaP等）等工件切割
    Electroplate nickel bond ultrathin hub blades can provide stable dicing performance of narrow street wafers. Use for Silicon wafer, Compound semiconductor wafers etc....

    • 采用电铸镍基结合剂工艺，划片刀刀刃具有超高强度，刀刃超薄，满足半导体晶圆窄街区的划切需求。

    适用于半导体硅晶圆、化合物半导体晶圆（GaAs、GaP等）、氧化物半导体晶圆（LiTaO3 等）等其他材料的加工。
    With electro plated nickel bond，ultrathin hub blades can provide stable dicing performance of narrow street wafers. 
    Use for Silicon wafer、Compound semiconductor wafers（GaAs、GaP）、oxide wafer(LiTaO3) and others.
  • 电镀封装切割刀 Nickel Blades for Package Dicing
    采用电铸镍基结合剂，配合粗粒度金刚石，实现超长寿命划切。适用于氧化铝陶瓷、EMC（热固性树脂）、PCB（印刷电路板）等各种半导体封装基板。
    A combination of nickel bond and larger size diamond grits provides long blade life performance. Use for Alumina ceramics、EMC、PCB and various semiconductor package base plate....

    • 采用电铸镍基结合剂，配合粗粒度金刚石，实现超长寿命划切。适用于氧化铝陶瓷、EMC（热固性树脂）、PCB（印刷电路板）等各种半导体封装基板。
    A combination of nickel bond and larger size diamond grits provides long blade life performance. Use for Alumina ceramics、EMC、PCB and various semiconductor package base plate.

     

  • 微孔陶瓷吸盘 Microporous ceramic chuck table
    产品适用于半导体、光伏、OLED以及PCB等领域，包括划片吸盘，背减吸盘，清洗吸盘等。
    The product is use for semiconductors, photovoltaics, OLEDs and PCBs, including chuck tables for dicing, back grinding, cleaning processes etc....

    • Chuck Table Product Features

    High precision and good stability—parallelism ≤ 3u（12 inches and less)

    Good ventilation—The pressure difference in 10x10mm area can reach ± 3Kpa

    High hardness and good durability—The hardness reaches above grade Y

    Equipment models that can be matched

    Grinding/Back Thinning—All series of Disco,German G&N, Okamoto, Accretech and Korean AM

    Dicing—All series of Disco, ADT and TSK

    Groove/Chamfer— TSK VGM4000/5000/6000 series; Daitron EMPEC-200 series

  • 刀架 Flange
    刀架应用于半导体晶片、陶瓷以及光学玻璃等切割领域，主要配套DISCO、ADT、TSK以及北京中电科、沈阳和研等精密切割机。包括软刀刀架和硬刀刀架
    Flange is used for semiconductor chips, ceramics and optical glass dicing processes. Include flange for Hub Blade and Hubless Blade
    ...

    • 刀架（Flange）应用于半导体晶片、陶瓷以及光学玻璃等切割领域，主要配套DISCO、ADT、TSK以及北京中电科、沈阳和研等精密切割机上，用于装夹各类切割刀片。我司可生产软刀刀架及硬刀刀架。

    Flange is used for semiconductor chips, ceramics and optical glass dicing processes. Our company can produce 2 '' 3 '' 4 '' Flange match DISCO, ADT and TSK models, include flange for Hub Blade and Hubless Blade.

Categories

300 Materials, Assembly
  • Scribe Tools; Saw or Dicing Blades and Accessories
    • 307 Materials, Process
  • CMP; Grind; Lap; Polish; Abrasive materials
    • 400 Components, Parts & Accessories
  • Chucks for Wafer and other Substrates
    • 900 Support Products
  • Tools
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