Welcome to visit @ Capcon Singapore Pte. Ltd!
Overview
Capcon Singapore Pte. Ltd is the leading supplier of total solution in advanced IC package at bonding process, we provide the advanced die bonder with the solid strengths as fine accuracy, high poductivity, flexible process application, mutiple material input, optional output carrer, large window feasible for die / carreer dimension ( 0.5 ~ 100 mm ), ....etc, it also covers the C2S, C2W, C2P package applied, w/ Face Up and Face Down optional application, in order to meet the customer's total demand, in advanced IC packaging field at die bonding process.
Capcon's provided bonders could almost cover the whole request at all different advanced IC package type, like FOWLP, PLP, 2.5/3 D, Stacked Chip, MCM, SiP, Chiplet, CoWoS, Hetergeneneous Bonding, ...etc, through our trustable and stable bonding solution.
Capcon's service location are as below, it's to fulfill the different customer's demand from different territory.
Singapore - main RnD and quipment assebly side, w/ sales, service and application team supportive for SEA
China - euopment assembly, sales / service / application @ Suzhou, sales / marketing @ Beijing
Twaiwan - sales / service / application team
Capcon is with ultimate honor to collaborate with our customers, to develope and tape out the customized bobder type, based on customer's different demand, no matter what is observed from current traps at bonding process, or in the future request at the developed product roadmap, Capcon might provide the entire supports, as win-win based, to colaborate with customers to overcome their bottlenecks.
Products