The first MIT IR Assisted bonding with real Light-Radiation process
The Rapid、Precision & Stabilization of automatic temperature control system
Development of advanced bonding technology for Multi-Chip Package and SiP
Suitability for Heterogeneous Materials with Wide range of heating control
The best choose of thermal process for Solder-Joint with High Throughput and Low Warpage Solution
針對異質材料的解決方案
快速昇溫 / 精準控溫 / 穩定持溫
異質材料的廣泛加熱適用性
多晶片及系統構裝的鍵合技術開發
高產出效率
低翹曲形變方案