- Screening Latent Defects: Ensures that dice with a high predicted failure probability, which have passed the Wafer Sort stage are filtered out.
- Reliability improvement: It provides an automated, cost-efficient method for downgrading the Wafer Sort map and/or implementing adaptive burn-in.
- Balanced approach: Achieving a balanced screening process that minimizes both unnecessary rejection of functional dice (overkill) and the risk of undetected defects (underkill).
- Early Warning System: Receive early alerts for process issues immediately after the defect inspection stage, enabling timely corrective actions.
- Sustainable Manufacturing: By identifying potential latent defects before assembly and customer delivery, you can reduce waste and align manufacturing with the principles of a circular economy.
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