Fully auto Lamination equipment group:
- BG taping
- BSP lmination
- Metal(glass) Carrier lamination
- Wafer mounter
Fully auto detaping equipment group for 8"/12"
- BG detaping
- Thermal release tape debonder
Wafer sorter group:
- Coin stack to wafer cassette or wafer cassette to Coin stack
- Wafer cassette fo FOUP or FOUP to wafer cassette