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Advanced Global Alliance Limited

Singapore,  Singapore
http://www.aga88.com
  • Booth: L1130

  Products

  • Schunk
    The FX20-L is suitable for ultrasonic welding of power electronics (e.g. IGBT modules) or cell contacting systems (battery applications). The machine is a semi automated system....

    • The FX20-L is suitable for ultrasonic welding of power electronics (e.g. IGBT modules) or cell contacting systems (battery applications). The machine is a semi automated system.
  • Pink
    Vacuum assisted, small scale sintering system SIN 20 For R&D and small series production....

    • Vacuum assisted, small scale sintering system SIN 20 For R&D and small series production.
  • Infotech
    COMPONENT MATRIX
    ...

    • Due to major investments into the research and development of strategically needed peripherals, it was possible to build the Infotech Component Matrix. Based on these modules, reliable products can be realized as flexible as building special application machines, but with an extremely high quality level comparable with standard machines. Process specific, modular and nevertheless standardized:
    PRODUCTION CELLS – PLATFORMS – ASSEMBLING – DISPENSING – FEEDING
  • Infotech-desktop
    Desktop dispenser
    ...

    • The IP-500 Desktop Dispenser is a multi-functional
    dispensing system possessing a wide variety of
    applications. It is highly suitable for precise dispense
    applications in laboratories, for prototypes and in the
    flexible production of small batches.
    The machine is delivered as a desktop model.
    In the base configuration, an internal time / pressure
    dispensing unit is included in its basic configuration.
    The dispensing axis can be equipped with different
    valves. The selection of which include time / pressure,
    precision micro-screw, jet dispensing valves and piston
    valves from different manufacturers.
    Dispensing of minimum quantities in the
    nanolitre range.
    2D and 3D dispensing
    Manual, semi-automatic and fully automatic versions
    Dispensing of grease, oils, paints, silicones, gels,
    epoxies, glues, bonding agents and many other liquids

Categories

200 Equipment, Assembly
  • Die Bonding; Attach Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Dispensing Systems
  • Package Handling; Conveying Equipment
  • Package Simulation; Characterization Equipment
  • Solder Reflow; Soldering & Brazing Equipment
  • Wafer Level Bonders
    • 202 Equipment, General Use
  • Welding Equipment
    • 203 Equipment, Inspection & Measurement
  • Wire Bonding Inspection; Test
  • X-ray; XRF; 3-D X-Ray; LEXES Systems
    • 700 Manufacturing Services
  • Welding; specialty welding services
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