CHIMEI CORPORATION

台南市,  台南市 
Taiwan
https://www.chimeicorp.com/zh-TW/
  • Booth: P5502

Overview

CHIMEI is a Taiwan-based high performance material company that contains 60 years of experience in polymer materials development. Our Specialty Chemicals Business Unit develops and manufactures photoresist, polyimide and adhesives. Nowadays, our specialty chemicalshave been widely applied in the semiconductor, panel and optical industry.

  Products

  • Thin Film Photoresist for Redistribution Layer
    CHIMEI's thin film positive photoresist is applied in redistribution layer. Furthermore, we also provide fine-pitch series and resolution upgrading material for this application to help usres meet the demand of higher resolution....

    • As more semiconductor industry’s influential end customers plan to achieve net-zero emissions for their supply chain, the adoption of mitigating emissions issues for semiconductor companies is inevitable.

    CHIMEI’s TD Series positive photoresist is the material solution for emission improvement. Through our R&D's formulation design for the binder and solvent, TD Series not only maintains the high sensitivity performance, but also reduces users' energy consumption for the lithography process.
  • Thick Film Photoresist for Copper Pillar Bump
    CHIMEI provides positive-type and negative-type thick film photoresist with the wide range of thickness from 20 to 100 um, and thery are applied in the copper pillar bump....

    • Traditional photoresists are added with Per-and polyfluoroalkyl substances (PFAS) to enhance its coating condition and sensitivity. However, due to PFAS’s health issues to human and environment, more proposed PFAS regulations start to motivate semiconductor companies seeking for alternative chemicals.
    CHIMEI’s thick film TC-Series positive photoresist is the material solution for the PFAS issue. Through our R&D’s new surface modifier design, it can offer the better coating improvement than PFAS does. Thus, TC-Series can perform the great surface uniformity without PFAS addition.
  • Photosensitive Polyimide for Passivation Layer
    CHIMEI's negative photosensitive polymide is used for the passivation layer. Our non-NMP type and low-temperatue type PSPI help users achieve NMP reduction and improve RDL deterioration issue....

    • Given that NMP usage restriction becomes the inevitable trend for semiconductor companies, CHIMEI’s negative photosensitive polyimide (n-PSPI) excluding NMP addition is the alternative selection for users.

    Furthermore, CHIMEI is also developing low-temperature PSPI. Through our R&D’s specific monomer design, the innovative synthesis process produces the soluble PI directly. This formulation design can help users reduce hard baking temperature from 350℃ to 170℃, effetely preventing the high temperature process causing the RDL deterioration. CHIEMI’s low-temperature PSPI is under development, and it is estimated to be launched in 2024.

  • Temporary Bond Material for Bondign Process
    CHIMEI's temporary bond material includes temporary bonding adhesion layer and release layer. With great mechanical properties and chemical resistance, these two materials are applied in the bonding process of FoWLP and wafer thinning....

    • To help semiconductor companies build the safer and more sustainable manufacturing, CHIMEI's temporary bonding adhesion layer and release layer are designed with low toxic solvent formulation. Without the usage of Substance of Very High Concern (SVHC), like DMAC or NMP, our R&D utilizes the green solvent to develop these two safer glue materials.
  • Lift-Off Photoresist for Metal Plating Process
    CHMEI’s lift off photoresist is applied in the high-thermal plating process for LED, optical sensor and quartz oscillator industries with its great thermal stability and stripability....

    • CHIMEI’s lift off photoresist can demonstrate great thermal stability under 300° C condition. Given that traditional lift-off photoresist encounters the stripping difficulty under high thermal condition, our R&D designs the specific binder formulation to make this photoresist stripped easily.
  • Micro Lens Photoresist
    CHIMEI's micro lens positive photoresist is applied in CMOS image sensor, optical equipment and LED with its great tranmittance and reliability....

    • CHIMEI’s Micro Lens Photoresist is the positive type photoresist system, and performs the great transmittance to build micro lens pattern applied in CMOS image sensor, optical equipment and LED. This photoresist meets the wide demand of film thickness from 2 to 20 um, and the minimum line space can reach to 5 um.

Categories

300 Materials, Assembly
  • Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
  • Thick Film Pastes; Materials
  • Thin Film; Dielectric Film Materials
    • 301 Materials, Chemicals & Solids
  • Other Specialty Chemicals
  • Photo Resist; Developers & Ancillaries (incl. Adhesion promoter (HMDS); Primer; Anti-Reflective Coat
    • 302 Materials, FPD
  • Alignment Film Materials
  • Color Filter Materials
  • Spacer Materials
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