Grintimate Precision Industry Co., Ltd.

Xitun Dist.,  Taichung City 
Taiwan
https://www.grintimate.com/
  • Booth: J2938

Overview

Mastering Key Technologies of Grinders. 

Closing to customer needs with total solutions.

GRINTIMATE PRECISION INDUSTRY CO., LTD, - a professional manufacturer of high-precision hydrostatic grinding machines, with exclusive hydrostatic bearing technology, including advanced hydrostatic bearing spindles, hydrostatic rotary worktables and hydrostatic guideway modules.  Full series are equipped with a hydrostatic bearing system, providing high-precision, high-quality, low-wear and environmentally friendly precision processing machines to our customers.

The hydrostatic bearing system features high rigidity, vibration resistance, non-contact between metals, high loading capacity and long service life, well regarded in high-tech industries, electric vehicle industries, aerospace, medical, metal processing industries, perfect for the grinding of a wide range of materials such as aluminum alloy, stainless steel, tungsten steel, ceramics, wafer, SiC, optical glass, etc.  Not only greatly improve the grinding efficiency but also maintain a stable and high precision accuracy during grinding.

Our main products include hydrostatic cylindrical plunge grinding machines-special purpose (CTS-100), hydrostatic cylindrical plunge grinding machines (CDC-series), hydrostatic cylindrical angular grinding machines (CAC-series) and horizontal hydrostatic rotary surface grinder (GRC-series).  Our Wafer Grinder GTR-1215 will be presented at SEMICON TAIWAN 2023 in this September.  Let’s expect it!!


  Products

  • GTR-1215
    半導體專用液靜壓立式晶圓減薄機
    Semiconductor Dedicated of Hydrostatic Wafer Grinder...

    • 榮獲2023年台灣精品獎。
    • 研磨同時監測磨削負載, 防止工件磨削過程中因壓力過大產生變形及破損。
    • 吸盤大小可根據客戶的需求定製, 滿足不同尺寸半導體材料的研削薄化工藝。
    • 晶圓厚度實時監測, 自動補正, 保證晶圓厚度的準確性。
    • 實現300mm矽晶圓減薄厚度<100µm、TTV<2µm, Ra 0.01µm。
    • 廣泛應用於高硬度材料研磨, 達到快速減薄及整平的效果。
    • 亦可選配花崗石底座。
    • 2023 Taiwan Excellence Award Winner
    • Online Monitor of Grinding status, prevent the wafer from being deformed and damaged.
    • Real-time monitoring of wafer thickness and automatic correction to ensure the accuracy of wafer thickness.
    • Chuck table could be customized according to the needs of different sizes wafers.
    • Achieve 300mm Si wafer thinning thickness <100µm, TTV <2µm, Ra 0.01µm
    • Especially designed for widely used in high hardness plane materials, rapid thinning, and achieve the effect of flattening.
    • Optional granite base.