3S Silicon Tech., Inc.

Hsinchu County,  Hsinchu County 
Taiwan
http://www.sss-tech.com.tw
  • Booth: N0676

Enabling Perfect Your Soldering For Power Devices Assembly.

Overview

3S specializes in providing intelligent automatic assembly machine systems that focus on the packaging technology of discrete power semiconductors. With a comprehensive range of solutions and services, our cutting-edge equipment includes the die attach machine, stencil printer, copper strip die bonder, vacuum reflow oven, and formic acid vacuum reflow oven. These advanced machines cater to the packaging needs of various power devices, including diodes, power MOSFETs, IGBTs, power GaN, SiC, IPMs, and more.

Pioneering Technology for Enhanced Safety and Reliability

As an industry leader, 3S collaborates closely with world-leading IDM customers and invest heavily in advanced packaging technology. Our commitment to innovation is driven by the aim to enhance safety, reliability, precision, throughput, and user-friendly maintenance in power devices and power module packaging. Notably, our expertise lies in vacuum reflow soldering and formic acid vacuum reflow soldering (flux-free soldering), particularly suited for high-reliability automotive and industrial applications.

Empowering Customers through 3S Open Lab 

At 3S Silicon Tech Inc. , we believe in sharing our expertise with customers. To facilitate their product development objectives for time-to-market, time-to-volume, and time-to-return on investment, we launched 3S Open Lab. This initiative enables clients to harness our vast knowledge and resources, fostering collaborative growth and success.

Committed to ESG and Sustainability—Green, Safe, Intelligent

As we embrace the dawn of ESG, 3S is deeply committed to contributing to energy conservation, green production, and pollution-free environments. We promote equal treatment regardless of race or gender, fostering respect, appreciation, trust, and commitment among all employees and stakeholders. Our equipment is designed to be Green, Safe, and Intelligent, harnessing the wisdom and resources of humanity for a better future.

In 3S , we are revolutionizing the power device packaging landscape, ensuring that our customers receive state-of-the-art solutions that drive progress and innovation in the industry. With a strong commitment to sustainability, ethics, and excellence, we are your trusted partner in powering a brighter future.

  Press Releases

  • (Aug 02, 2023)
  • (Aug 02, 2023)
  • (Aug 02, 2023)
  • (Aug 02, 2023)
  • (Aug 02, 2023)

  Products

  • Formic Acid Vacuum Reflow Oven
    *Capability
    45~90 secs/strip
    void rate ≤ 2%
    *Features
    conductive heating
    maximum size of working area: 300x200 mm
    carrier boat system (optional)
    catalyst system
    50 mm product height
    safety design (FA, CO) detection/protection...

    1. The first formic acid vacuum reflow oven applies to solder paste processes around the world.
    2. The quantity of FA can be controlled intelligently,and the consumption of FA is 1% of that of competitors.
    3. If the oven replaces the traditional soldering process,it can reduce waste solvent by 31 tons/year.
    4. The unique transferring system and acid supply system can increase capacity by 2-8 times.It can greatly reduce production cost of customers.
    5. The patented oven design has high heat transfer efficiency and saves 50% of energy.
    6. The exhaust gas is treated by plasma.No harmful gas emitting meets with EHS standard.
    7. Extremely low void rate and no flux residue improve the reliability of semiconductor components by 43%.It suits for high-reliability products such as IGBT,Power MOS,diodes,Copper Pillar Bumping, Sip Power Module and Micro LED.
                After verification by Infineon,the oven will be standard high-end IGBT packaging equipment.
  • Vacuum Reflow Oven
    *Capability
    throughput = 36~60 sec/cycle
    void rate ≤ 2%
    *Features
    flux filter
    conductive heating
    maximum size of working area: 300x200 mm
    flowfield analysis
    *Options
    profile meter
    oxygen meter
    carrier cycle system
    ...

    • Product Features:
    1. Customized design for automatic material handling, enabling rapid product line changes and increased welding efficiency.
    2. Enhanced product reliability by implementing customized oven temperature curves based on product-specific requirements.
    3. Fully automated intelligent machine, significantly reducing the need for human resources.
    4. Lowest unit production cost.
    5. Stable control of product bubble rate, improving product yield.
  • Reflow Oven
    *Capability
    throughput = 15~60 sec/cycle
    *Features
    low running cost
    small footprint
    conductive heating
    leadframe 300*100 mm
    filter system
    *Options
    profile meter
    oxygen meter
    flux filter
    carrier cycle system...

    • Product Features:
    1. Customized design for automatic material handling, enabling rapid product line changes to increase soldering efficiency.
    2. Enhanced product reliability by implementing customized oven temperature curves based on product-specific requirements.
    3. Fully automated intelligent machine, significantly reducing the utilization of human resources.
    4. Lowest unit production cost.
  • Stencil Printing Machine
    *Capability
    throughput = 42 sec/cycle
    printing position acc. ≤ ± 50 um
    printing angle acc. ≤ ± 1°
    printing area acc. ± 10%
    ...

    • *Capability
    throughput = 42 sec/cycle
    printing position acc. ≤ ± 50 um
    printing angle acc. ≤ ± 1°
    printing area acc. ± 10%
    *Features
    pre-print alignment
    post inspection
    auto stencil cleaning
    multiple strips handling
    high-level production parameter monitoring
    printing on chip capability
    BLT control
    *Options
    flexible input/output design
    SECS/GEM
  • Die Attach
    *Capability
    cycle time ≤ 250 m/sec
    position acc. ≤ 25 um
    angle acc. ≤ ± 1°...

    • *Capability
    cycle time ≤ 250 m/sec
    position acc. ≤ 25 um
    angle acc. ≤ ± 1°
    *Features
    leadframe alignment before attach
    chip inspection before picking
    post attach inspection
    pick/attach force control 20~200g
    auto height detection
    *Options
    wafer auto load/unload
    flip chip
    pick & place application
  • Clip Attach
    *Capability
    throughput = 1.2~1.5 sec/cycle (1~40 ea.chip)
    multiple strips handling
    position acc. ≤ 50 um
    ...

    • *Capability
    throughput = 1.2~1.5 sec/cycle (1~40 ea.chip)
    multiple strips handling
    position acc. ≤ 50 um
    *Features
    leadframe alignment before attach
    post attach inspection
    pick/attach force control
    hard stop
    auto height detection
    *Options
    strip clip
    up look camera

Categories

200 Equipment, Assembly
  • Die Bonding; Attach Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Dispensing Systems
  • Package Handling; Conveying Equipment
  • Printing Equipment; Screen-printing; Alignment ; Film Printing
  • Solder Reflow; Soldering & Brazing Equipment
  • Wafer Mount; Taping Equipment
    • 202 Equipment, General Use
  • Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating
    • Loading ...

    :
    :


    Legend
    Available Timeslot
    Scheduled Appointment
    Personal Appointments
    Appointment Request
    Blocked Timeslot
    Restricted Timeslot
    Cancelled
    Declined