Innolux Corporation

In FOPLP Chip first, we use wafer molding film & RDL processes to replace substrate, which is not only make the packaging technology be much more thin, light, short and small, but enhancing packaging’s integration ability by accomplished higher circuit density and connection density to effectively realize fine lines and connections, enable the FOPLP to accommodate more components in the same package area.

Besides the above advantage of FOPLP, we believe it have the high potential for future technology field due to below significant figures,

Performance:

1. Better bond pad contact resistance

2. Thicker Cu trace for higher electric current

3. Thicker dielectric layer for higher breakdown voltage

4. Better heat dissipation design

5. 6-side EMC protection to pass MSL1 (Moisture Sensitivity Levels)

6. Cost reduction for Flip-chip product.

7. Lower contact resistance and higher switching frequency for power devices (5G, Automobile, Solar energy, Energy storage, Transportation, Charging Pile…)

To sum up, nowadays technology changes rapidly, due to FOPLP can widely apply to various area, bring high efficiency, low energy consumption, low cost but better heterogeneous integration ability, it will be the trend for future advanced packaging technology.  

The world largest RDL substrate (size: 620 mm * 750 mm) was fabricated by using INX’s existing G3.5 panel facilities as well as new panel plating equipment, which can automatically coat photosensitive polyimide and form fine pitch copper trace on the panel to form multi-layer RDL substrate. This G3.5 RDL substrate can cut to 18 strips (95 mm * 240.5 mm), and utilized traditional flip-chip equipment for back-end assembly process

The feature of this film type RDLs can make flip-chip package thinner compared with conventional flip-chip package with ABF or BT substrate which is more suitable for mobile application.

Product features:

→ Capable of RDL layers: 2~4 layer, total thickness: <50um

→ Line/space: 5/5um~15/15

Product application:

→ RDL substrate for WIFI, BT, PMIC, AP IC package 

→ RDL substrate for System in package

Innolux offers a Panel Level Packaging(PLP) material analysis and simulation platform that supports the in-house numerical and experimental integration in this analysis platform including modeling and simulation, material testing and analysis solutions. In the PLP technology development, the accumulated experience and material database were built on offering the major functions including: 1. Material analysis and testing; 2. Package design simulation and modeling; 3. Process simulation and integration; 4. Product reliability assessment; and 5. Product verification and Failure Analysis for PLP technology development.

Moreover, the material analysis and testing play a key role in the material analysis and simulation platform. The Testing Center in Innolux invested the functional laboratories with diverse analyzers and facilities. Based on the in-house material measurement and analysis results, the real material properties and the experimental verification were used for simulation modeling and validation.

Design simulation is a modeling guideline in the simulation platform that provide both mechanical design and electrical layout for package product based on heat dissipation of package and electrical characteristic requirements. According to Signal and Power integrity, the signal transmitting channel quality and IC power supply network will be optimized and considered with integrated electrical-thermal-mechanical analysis for offering a complete electronic layout and chip design.

For the large panel warpage evaluation in the PLP process, the process simulation is a key technology for making breakthrough improvements. The optimal combination of package design, material selection, and process integration will be analyzed to mitigate the materials' mismatch effects by simulation model to overcome the challenges in PLP process with large panel warpage substrate and keep the PLP production running smoothly.

The package reliability predication by simulation is used for product life evaluation based on structure design and material selection to integrate material, product structure, and process-induced stresses for board level life and material fatigue risk assessments. The modeling in design for reliability and package development, the product application, suitable package design, material selection, structure design and process tuning will be applied in the initial stage of the product development.

Innolux developed the PLP material analysis and simulation platform to perform the characteristic analysis of highly integrated Material, Process, Product design, Product verification and Failure analysis for the customized package products development and modeling.

The material analysis and simulation platform with the capabilities of package design, process integration and reliability prediction for product development will help to overcome the issues of PLP technology and production development that realized the world first Display panel production line transformation for package manufacturing and applications.

Industrial 4.0 is revolutionizing industries by transforming the way of production, manufacturing, and distribution, while also solving the manpower shortage caused by population decline. This concept harnesses cutting-edge technologies such as IoT, AI, big data analytics, and robotics to foster efficiency, connectivity, and an unprecedented expansion of productivity.

To leverage the benefits of Industrial 4.0, Innolux has launched a P-AMR (Panel Level Packaging Autonomous Mobile Robot) for efficient panel delivery between stations. This P-AMR combines a roller conveyor and an AGV (Automated Guided Vehicle) to transport a 700 mm*700 mm metal plate with the panel wafer on it.

Cleanroom-Standard-Class-10 Chamber

To ensure optimal integrated circuit performance and maximize manufacturing yield rate, it is essential to control contamination from particles during wafer fabrication. Therefore, Innolux utilizes design know-how to minimize the particle presence in the chamber, ensuring that the particle level conforms to the class 10 cleanroom standard.

Anti-vibration Feature

Since wafer chips are fragile, cracks or damages occurring on the chips can directly impact the electronic performance of the integrated circuit. To prevent damages during delivery, Innolux has incorporated an anti-vibration feature into the P-AMR.

Anti-ESD

ESD is a significant cause of device failure in the semiconductor industry. This P-AMR is designed with anti-ESD materials to prevent ESD from damaging semiconductor products during delivery.

Flexible Unloading Orders

The PLP unloading order is typically designed as 'first in, last out,' which can impose limitations on delivery route planning and may even necessitate a re-layout of the manufacturing plant. In response to this challenge, Innolux has developed the P-AMR with flexible unloading orders, allowing for the adaptable design of delivery routes based on the manufacturing plant layout.

Intelligence Positioning

If the machine starts to load or unload the wafer at the wrong position, it could lead to the wafer hitting the wafer-loading platform. Innolux's P-AMR is designed and equipped with an intelligent positioning function. By using an additional optical sensor for secondary positioning, Innolux's P-AMR is able to achieve 100% accurate positioning.

Compact Size