Jipal Corporation

Post Wire Bond Inspection System

Emage Hemis23D

Emage’s AOI equipment models equipped with latest imaging innovations providing high-speed 2D+3D inspection & optional High Resolution Bond inspection station to address today’s specific semiconductor packaging needs.

Main Features:

• Complete inspection portfolio.
  • Incl. 3D loop height at 11µm repeatability.
• High speed enables 100% inspection.
  • Example: 120 strips/hr for 9"x2" size.
• Robust scanning: OTF capturing of 6 images/FOV.
• Including HR station for review or specific ROI.
• Experienced team.
• Simple design, & user-friendly recipe setup.
• Image stitching – Panoramic Technology.
• OTF, single FOV, Subpixel stitch accuracy.
• No FOV limitation for bigger devices.
• Ability to cover any packaging/ device type in Semiconductor

Virtual Assistance Control System(VASC)

Emage Ebox

The EBox purpose is to capture EVERY screen, mouse, and keyboard sequence.

The ability to capture, allow us to create a Reinforced Learning model (RL) and/or algorithms to make the Correct Operation Sequence (just like what a human verifier does with the software) within the OEM software e.g., operationally same key sequences, mouse movements, and also screen capture, Without Human Invention.

Main Features:

•     Non-intrusive interface with machines
•     Hybrid AI software to set up machines or monitor its’ performance
•     Able to control the machine's functions automatically.
•     Options to add AI Deep Learning for defects classifications
•     Easy to set up and applicable to many processes.

Wafer Level Solder Ball Mounter

ABM-04G-WFS

Enabled High Quality & Stable Production by Special Flux Printing Technology and Infinity Squeegee Head.

Main Features:

* Ensure and deliver mass-production by 40um solder ball.

Flux Printing

・Reduced Flux Bleeding by Gap Printing.

・Stabled Transfer Position by One-direction Printing Mechanism.

・Minimized Cleaning Frequency.

Ball Mounting

・New Infinity Head (Triple Type Rotary & Closed Type Squeegee)

・Higher Throughput.

・Minimized Sweeping Frequency (1/3 compared with the conventional type)

・Increased Solder Ball Use Efficiency (1/2 compared with the conventional type)

Other Options:

• Inline Integration to Inspection & Repair System.

• Customized to run Film Frame Carrier.

New concept product, Plasma Laser Repair

ALR-04G-P4

Plasma Laser Repair Equipment for Semiconductor Packages enabling Yield Improvement.

Main Features:

・Enabled Inspection and Repair for Solder Ball Drop Defects during Reflow and De-Flux Cleaning Process after Ball Mounting.

・Realized Spot Reflow soldering (local soldering for only repairing points) by integrating Plasma and Laser Technologies.

・Minimized Reflow Process impacting qualities of Semiconductor Packages.

・Realized Inspection & Repair for Ball Drop Defects during Reflow and Cleaning Process.

・High Speed Overall Surface Inspection for Works.

・Flux dipping & High Precision Solder Ball Mounting.

・Soldering by Plasma & Laser technologies.

・Proposal for Off-Line or In-Line System.

Wafer grinding wheels

晶圓研磨砂輪

Wafer grinding wheels are used in the in-feed grinding process of semiconductor wafers. The in-feed grinding process consists of rough and fine grinding processes. Wafer grinding wheels are made of diamond abrasives and customized vitrified bond in a unique porous microstructure.

Features:

• Wafer grinding wheels perform a stable high removal rate, longer lifetime and lower/consistent grinding resistance during processing.

Application:

For thinning process of

 ＊TSV package wafers (Cu/compound).

 ＊SiC, sapphire, Si and reclaimed wafers.

 ＊MEMS/LED, diode etc.

Specification:

Dressing board

修刀板

Dressing board is used to get a better cutting quality and throughput of dicing blade in IC Assembly front end-Wafer saw process. Dicing blade can be newly pre-shaped and re-sharpened via dressing board to stabilize processing, and to minimize the chipping of as-cut die edge.

Features:

• Dressing board, with flatness to firmly suction on chuck table larger than 80Kpa, can efficiently remove clogging and glazing of dicing blade with less consumption.

 Application:

• Dressing board is used to pre-shape a new dicing blade by trimming its uneven edge and to expose diamond grits on its edge for cutting.
• Dressing board is used to re-sharpen a dicing blade by interval dressing to restore and maintain the stable cutting ability during processing.

Specification:

Porous Ceramic Chuck Table

多孔質陶瓷真空吸盤

High precision porous vacuum chucks are indispensible and excellently suitable for processing of various thin workpiece in semiconductors, solar energy, LEDs, liquid display and PCBs industries etc.

Features:

• High-performance,  High-precision,  Uniform suction force.
• Partial chucking without sagging.
• Chucking and transport of wafer without leaving suction marks.
• Produces no static electricity and dust.
• Reusable (after rework)

Application:

• High precision porous vaccum chucks are suitable and can be tailored for grinding,   cleaning, dicing and measuring processes of semiconductor wafers etc. upon customers' request

Specification:

Transfer Molding System 

STM-120 Auto

Equipment feature

• The STM-120 is enable maximized 85x270 mm frame size and molding with 120 tons clamp capacity.

• Clamp pressure is flexible, Pressure range 20~120 tons.
• TCM ( Transfer & Compression Mold ) ---- Wide range of products.

Customized Options 

• Tablet weight / Cavity vacuum / Substrate bottom vacuum / Release film etc…

Transfer Molding System

STM-180 Auto

Equipment feature

• The STM-180 is enable maximized 100x300 mm frame size and molding with 180 tons clamp capacity.
• Clamp pressure is flexible, Pressure range 20~120 tons.
• TCM ( Transfer & Compression Mold ) ---- Wide range of products

Customized Options 

• Tablet weight / Cavity vacuum / Substrate bottom vacuum / Release film etc…

Wafer Level Molding system 

SWM-90 Auto

Equipment features

• 12-inch wafer and panels convertible type. According to customer selection.
• Equipped with independent control of 4 servo motors, achieving micrometer level parallelism.
• 8-speed compression molding to achieving uniform resin flow in the mold cavity.

Customized Options 

• Bottom film unit / Mold temperature monitor etc….

Equipment specifications

Packaged IC Inspection and Metrology Systems

ICOS™ T3x0/T7x0

KLA’s ICOS division sets a new standard in the inspection of packaged semiconductor ICs. Its highly flexible design provides a solution for every inspection requirement. Base configurations focusing on minimizing cost of ownership, as well as highly advanced models providing solutions for the most challenging quality needs are available. It consolidates decades of experience, research and development into a single platform, making it the most versatile platform on the market today.

Key Features:

• Dual Tapers
• 14 Nozzle inspection Handing
• Dynamic tray compensation (DTC)
• 7 Nozzle taping with automatic pitch change over
• aPVITM option
• Post seal inspection option

​Packaged IC Inspection and Metrology Systems

ICOS™ T890

KLA’s ICOS division sets a new standard in the inspection of packaged semiconductor ICs. Its highly flexible design provides a solution for every inspection requirement. Base configurations focusing on minimizing cost of ownership, as well as highly advanced models providing solutions for the most challenging quality needs are available. It consolidates decades of experience, research and development into a single platform, making it the most versatile platform on the market today.

SIGMA: Innovative 3D Metrology

• The new-generation ICOS 3D module provides unprecedented inspection capability at unseen accuracy.

SPECTRUM+ and SPECTRUM+ RB: Advanced 2D Inspection

• SPECTRUM+ is the latest-generation 2D Package Visual Inspection module. It can be applied to inspect both the top and bottom of the device. It can also be embedded inside the Sigma module.

HS5S+ and SPECTRUM+ 5S

• High-speed, device side inspection is available in different resolutions and with or without color inspection, depending on the production requirements.

Packaged IC Inspection and Metrology Systems

ICOS™ F260

The ICOS® F 260 die sorting and inspection system provides high performance die sorting with integrated, fully automated inspection of diced wafer level packages The ICOS F 260 system includes the state of the art, new generation IR inspection module, which provides reliable detection of hairline and sidewall cracks with minimal overkill at high throughput.

IR technology for sub-micron crack detection

• Using advanced SWIR technology, a variety of cracks such as hairline and sidewall cracks, in- and outside of the device, are reliably detected with extremely low overkill and zero underkill. The F260 inspection capability can achieve sub-micron hairline cracks detection.

Laser groove crack detection new module

• Laser grooving-based dicing processes can result in microscopic cracks in the laser groove area. These cracks are invisible on all sidewall illumination-based platforms. With the new generation LGC module, a unique optical path was developed to ensure that these performance-critical cracks are reliably captured in an early stage, before propagating through the active area of the device.

Flexible input and output medium allows for advanced die sorting

• F260 supports a wide combination of input and output mediums. Wafer, tape and tray are all supported as an input and output medium.

High End 6S inspection

• F260 also offers high resolution 6S optical inspection to detect chippings, sidewall cracks and foreign material. On top, it provides accurate measurement data on sizes and orientation.

Fast conversions and automatic calibration

• F260 is designed for an easy and fast conversion. The changeover is highly automated with nozzle height calibration, motorized mirror positioning and a calibration wizard. The automatic calibration minimizes downtime and maximizes utilization, resulting in an improved cost of ownership.

Genesem is a manufacturer of essential equipment necessary for the semiconductor back-end process industry and provides more than 50 types of semiconductor back-end process equipment. Genesem has a competitive edge in the stability of its equipment, convenience of operational software, product quality, and swift technical support. At EMI Shield Equipment, Genesem is committed to being the best solution-provider for our customers.

Tape Mounter

GTM-1000

Attach

VELOCE-G5-TTF

Small PKG Detach (Unloader)

GSDS-1000

Detach (Unloader)

VELOCE-G5-FTT