NDS (TAIWAN) CO., LTD.

樹脂刀
樹脂結合劑切割刀片，具有高速切削與自我再生的特性，因此能有效改善對於具有延展性及粘性
材料如QFN類及銅類產品，以及硬脆材料如玻璃及陶瓷類產品的切削加工效率及品質。
Resin Bond Blade
Resin bond blade, with the characteristic of free-cutting and self-sharpening, can efficiently improve cut quality and efficiency on ductile and gummy materials such as QFNs and coppers and on hard-and-brittle materials such as glass and ceramics.
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電鑄鎳刀
電鑄鎳刀具有超薄、高強度、高剛性等特點，在切削加工過程中，能夠穩定持久的保持良好的切削性及切割品質，同時保持非常低的刀片磨耗率。
Electro-formed Nickel Bond Blade
Electro-formed Nickel bond blade, featured by ultra thin, high strength and stiffness, is extremely rigid. It can give high endurance and robust properties during cutting process while maintaining very low blade wearing rate.
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金屬刀
金屬燒結刀由於是混合金屬粉末在高溫高壓下模壓燒結而成，因此具有高剛性及壽命長的特性。
NDS 的金屬燒結刀由於具備高耐磨耗性，均勻的刀刃磨耗及高韌性，能非常有效的降低如斜切與切割晶粒尺寸及形狀異常等缺陷，同時依然提供非常長的刀片壽命。
Metal Bond Blade
Metal bond blade, sintered and mold pressed under high temp. and pressure, has high rigidity and long blade life. With higher wear-resistance, balanced blade wearing profile, and higher stiffness, the metal bond blades can effectively reduce cutting defects such as slant cut and PKG size/profile issues while providing very long blade life. 

S3000
單面UV膜使用PET基材一般主要使用在玻璃,陶瓷等易產生chipping的工件製程上。
Single-sided and double sided are available with UV cured adhesive.  

S4000
單面UV膜使用PO基材延展性佳，能緊密貼合於工件上。
Single-sided dicing tape with UV cured adhesive. Anti-static types also available. 

S5000
分別有兩款，單面UV膜及單面NON-UV膜 使用PVC基材，基材材質較軟。因為UV解膠後黏著力較低，易撕開，方便於擴片應為確保切割時的黏著力。

• Polishing Template

This is to replace traditional method of wafer fixing during Chemical Mechanical Polishing (CMP) process. No more worry of waxy residue and wax cleaning process. It offers cushion benefit for best protection for various kinds of wafers. Together with slurry, the poromeric material of template absorbs sufficient moisture after wetting and produces necessary adhesion to hold the wafer well. The superior performance of template can reduce machine down time and increase productivity.
It can be used for single-sided polishing applications. 

• Polishing Pad 

It is applied to coarse, middle and fine polishing during the Chemical Mechanical Polishing (CMP) process. With advance PU foaming technology, high planarization and removal rate can be achieved. NDS polishing pads are customized for polishing varieties of workpieces such as silicon wafers, reclaim wafers, SiC, GaAs, sapphire, quartz, ceramic and etc.

• 晶圓清洗機Wafer Cleaner

二流體噴嘴及噴氣嘴
10組清洗制程配方，每組可設定8個執行步序
10組配方儲存記憶，方便人員選用
人機顯示/ PLC操控
Atomizing cleaning with nozzle 
10 sets of cleaning programs
User-friendly interface / PLC control
Rapid cleaning
Customized solution for cleaner with solvent and brushes are also available upon request

• 晶圓貼膜機Wafer Mounter

滾輪移動利用線性滑軌，不易產生粉屑
滾輪下壓壓力以氣壓控制，可調節滾輪貼合壓力
上蓋轉盤採多點接觸，不易磨耗且操作容易
真空吸盤下方有加熱器，最高溫可達70℃
Built-in linear roller to avoid dust
Adjustable pressure to control the roller
Robust design

ThermasolvTM dielectric cooling fluids. These fluids are specifically designed for electronic and electric applications and provide superior thermal management and protection for your equipment. 
ThermasolvTM fluids ensures optimal performance and prolonged lifespan for your devices.
Whether you’re looking to cool down high-powered electronics, protect heat sensitive equipment or looking for an alternative way to cool servers & super computers, this solution has got you covered.