- The Batch-Type plasma System GIGA 690 can be products inside of the original slotted or unslotted magazines or in other carriers. The plasma cleaning process uses gases such as Ar, O2, N2, H2*, CF4 or mixtures thereof. Oxygen is one of the most frequently used process gases for the chemical surface treatment. (* pure H2 requires special safety features
Process gases are ionized through microwave excitation in a
vacuum chamber under low pressure of 0.1-1.5 mbar. Chemical
radicals generated in this low-pressure plasma are reacting with
the product surface and will either activate or clean it by forming
volatile compounds, which are removed by the vacuum pump.
- The Strip-Type Plasma System 80 Plus is a low pressure plasma system for cleaning advanced chip packages prior to wire bonding, molding and solder ball attach, as well as prior to Flip Chip underfill. Process gases are ionized through electromagnetic excitation in a vacuum chamber under low pressure. Typical operating pressure is 0.1 – 1.5 mbar depending on the application. This low-pressure plasma produces ions and free radicals. They interact with the substrate surfaces by forming volatile species which are removed by the vacuum pump. The plasma cleaning process uses gases such as Ar, O2, H2 (special items required) or mixtures thereof
The 80 Plus plasma system has two different configurations
to create the process radicals, depending on the nature of the
required cleaning process. Microwave excitation provides a
very isotropic process with high radical density and low DC
Bias at the level of the product. The result is a process with
high ability to clean even smallest gaps, i.e. prior to underfill
in Flip Chip packaging applications. It is very effective for
purely organic layers to be removed and yields very low
contact angles even at very short process time. Using
13.56MHz as excitation frequency provides a combination of
physical and chemical etching effect, so it is more effective
on layers with inorganic components, so the typical
applications would be prior to wire bonding.
Configuration “GIGA”
Microwaves of 2,45 GHz are simply applied on top of the vacuum chamber producing a largely extended plasma there. The stripes are processed in a downstream configuration. Due the use of microwaves the Plasma System 80 PLUS provides for fast, low temperature and damage free plasma processing.
Configuration “ION”
RF of 13.56 MHz are applied via electrode to the vacuum chamber. The system is easy
to operate and features simple loading and unloading, either manually or automatically.
The System software complies with standards in semiconductor industries. Due to the
short process time the system can be integrated into fully automated assembly lines.
Please find more info by clicking here.