Welcome to TELTEC Semiconductor Pacific‘s booth - J2246
Overview
Teltec Semiconductor Pacific Ltd (www.teltec.asia) is a leading Sales and Service organization serving the Semiconductor (Back and Front End) and Research Industries in the Asia Pacific Regions for 40 years.
Our represented products cover the following applications:
A) Failure Analysis
i) Denton Vacuum: Gold or Carbon Coaters for SEM and TEM
ii) Comet-Yxlon: X-ray Inspection Systems, High Resolution Industrial Horizontal CT
iii) Nisene: Automated Acid Decapsulation Systems
v) Royce: Automated Die Sorters & Bond Testers
B) Metrology
i) Akrometrix: Thermal Warpage and Strain Metrology Systems
ii) Bruker: AFM, Optical Profilers, X-ray Diffraction(XRD), Nanoindentors ,Stylus Profilers
iii) BNC: Pulse and Delay Generators
C) Photolithography
i) Kayaku Advanced Materials (Microchem): Photoresists for Lift-Off, MEMS, Compound Semiconductor, E-beam Lithography, Wafer Bonding and Wafer Level Packaging
ii) Nippon Kayaku: Dry Film Resists (For MEMS, Wafer Level Packaging)
iii) OAI: Mask Aligners & Exposure Systems
iv) CEE: Spin Coaters, Bake Plates, Developers, Bonders & Debonders
v) AML: In-situ Aligned Wafer Bonders
vi) Ultra t: Wafer, Substrate and Mask Cleaners
D) Substrate surface modification & Cleaning
i) PVA Tepla: MW/RF Plasma Cleaning Systems
ii) Jelight: UVO cleaners
E) Reliability
i) Heller: Reflow Ovens， Pressure Curing Ovens
ii) Microtronic: Solderability Testers
iii) Web Technology: Centrifuges, Bubble Testers
F) Vacuum Deposition
i) Chemcut: Wet Processing Equipment
ii) Denton Vacuum: Thin Film Deposition Systems
iii) Veeco: ALD Systems
iv) Paratronix: Paralyene Coating Systems
G) Molding & Die Bonding
i) XinSheng: Automated Molding Systems
ii) Capon: Automated Die Bonders
iii) Abet: Solar Simulators
Address: Rm. 2802 Wing On House, 71 Des Voeux Road Central, Hong Kong
Tel: (852) 2521 4213
Email: info@teltec.asia