Hi-Lo System Research Co. Ltd

Up to 3500 UPH (Units Per Hour)

Up to 6 units of ALL-200G / ALL-300G2 programmer with up to 96 sockets.

Handles 0.5mm x0.5mm - 40mm x 40mm devices.

2D/3D vision inspection on IC leads/balls/pads to prevent any defect 

Intelligent software and high standard quality control

24/7 technical support

Equipped with 2-8 units of ALL-200G or ALL-300G2 programmers

16-128 devices can be programmed simultaneously

The best option for high-end IC production in such industries as automotive or military

Equipped with laser marker and optional 3D inspection makes it a pertect total-solution

Completed perpheral devices such as laser marking. inking.and 3D inspection

Develop customized algorithms and software to help our customers meet their long term production plan at best efficiency.

Higher level of measurement precision and accuracy, more measurement items and dimensions than other.

These measurement and inspection items are commonly available in the field,regardless of single die or multi-die or stacked die.

Equipment can be applied to Wire/Ball materials,including common materials such as gold,silver,copper,and aluminum.

Advanced Precision 3D camera

IC Lead/Ball Scan, Measurement and Inspectation

Optional and easily replaceable KIT Modules

In-system Automated Tray load /unload System

Swift Auto-Pitch Device for Pick & Place

Mark Inspection

Customized Light Source (Multiple angles)

Automated Machine Learning

Higher Image Resolution

Higher Stability

5 axis Die Bond Measurement System which achieve measurement items as Silver Paste Thickness, Die Tilt, Epoxy Fillet Height, Die Location and Rotation.

Equipment can be applied to Wire/Ball materials,including common materials such as gold,silver,copper,and aluminum.

These measurement and inspection items are commonly available in the field,regardless of single die or multi-die or stacked die.