The new robotic that's suited for the needs of future semiconductor miniaturization and multi-layer applications has finally arrived! The core competence of the product is that It uses a DD motor design, which can minimize the effects of stress on wafers during automated handling, also meets the needs of various wafer handling applications requiring high speed and high precision.
Product feature：
Vibration acceleration：0.25G以下
Repeatability：±0.02mm
Absolute positioning accuracy：0.05mm
Product specification：
ISO Clean Class 1
SEMI S2，S8, F47
UL61010-1
ISO 13849-1, Category 3（PL=d）