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New Smart Technology Co., Ltd

Neihu Dist.,,  Taipei 
Taiwan
http://www.newsmart.com.tw
  • Booth: K2970

歡迎蒞臨K2970和亞智慧科技股份有限公司
Welcome to NSTC , our booth is K2970.

Overview

NewSmart Technology was established in 2015 and is headquartered in Taipei City. The company is based on up to ten years of expertise in optical imaging products, as well as a complete team from design to production process.

The members include optical, mechanical, electrical, and software, production process, automation professionals. The overall capabilities are able to provide customers with the best integration solutions and technical support.

We are focusing on research and development for optical image technologies, which covers optical products, automotive electronics, automation equipment, technology solutions and technical consultants.

For the rapid changes in technology, we are committed to the promotion of innovative products and technologies to provide customers with Better products and services.

Looking into the future, we will adhere to the philosophy of “Continuous Innovation, Pursuit of Quality, and Strive for Excellence” and move forward towards a world-class design company.


  Press Releases

  • (Jun 06, 2024)
  • (Jun 06, 2024)
  • (Jul 03, 2024)
  • (Jul 03, 2024)

  Products

  • OSD-T200/300 Ultra for 2D+3D AOI
    OSD-T200/300 Ultra for 2D+3D AOI...

  • The trend of semiconductor advanced manufacturing process is to develop the wafer towards multi-layer stacking, so that the size of the wafer is smaller, more power-efficient, and more powerful; therefore, the evolution of 3D stacking technology and heterogeneous packaging technology will drive the development of automatic optical inspection technology towards more precise inspection.

    3D packaging has become the focus of TSMC, Intel and Samsung. TSMC is engaged in advanced process wafer-level internal packaging, and the major packaging and testing houses in Taiwan will also focus on system-level packaging (SiP) and integrated antenna package (AiP) for R&D. In addition, various 5G cell phones are expected to use AnyLayer HDI and Substrate-Link PCB (SLP). Due to the huge amount of data to be handled, the focus is on energy and heat dissipation, so the high speed computing products use 2.5D and 3D large integrated package structure to enhance the speed and quality of signal transmission.


    Mainly by regrouping class carrier board, silicon carrier board and RDL as a bridge for communication between wafers, the line spacing can be reduced by 4~5 times compared to traditional substrate. The reduction of line width and line spacing can effectively increase the footprint of the package and shorten the signal delay time to improve the overall system performance, and there will be a certain market demand for AOI inspection devices with line width and line diameter smaller than um.

    NST 3D Metrology Function performs sample height and coplanarity measurement for C2&C4 Wafer Bumping and 2.5D Wire Bonding process by using 3D High Resolution Optical System to ensure consistent Bump height and stable Bump and Substrate bonding.

    Features

    • High-speed 3D Full Bump height measurement
    • Bump Diameter
    • Bump Height
    • 3D multi-functional measurement system
    • Support high aspect ratio products (AR 1:7) μBump tall pillar 3D measurement
    • Easy-to-use visualization of various engineering analyses
    • Contour map
    • Contour map
    • 3D profile
    • Auto switching multi-magnification microscopic inspection system
    • Nanoscale Auto Focus System
    • Large-size chip alignment system (Multi-View)
    • Recipe off-line editing function
    • Multi-Thread image comparison algorithm system
    • Visual measurement system to detect key dimensions by image measurement
    • Import CAD to save Recipe creation time
    • Automatic calibration and inspection system
    • Customized report output
    • Fast loading and unloading (<10sec)

    Optional

    • AI Function
    • OCR function
    • Review /re- judgment system
    • EDC function
    • Real-time process status display
    • SECS/GEM compatible
    • SEMI S2 security certified
    • High warpage solution

    Critical defect

    • Residue
    • Particle
    • Damage
    • Open / Short
    • Scratch
  • OSD-T201 for Wafer AOI ( NSTC AOI System )
    OSD-T201 for Wafer AOI ( NSTC AOI System )...

  • OSD-T200 AOI inspection machine uses a high precision optical image inspection system to inspect the surface condition of the material, supplemented by image processing technology, to detect defects such as foreign objects or abnormal patterns on the surface (internal) of the material.

    The defective images are then transferred to our Multi-Thread comparative algorithm system and AI analysis system, and fed back to the pre-processing process for full automatic adjustment of the relevant process parameters.

    Critical defect