Asmade (Shenzhen) Semiconductor Technology Co.,Ltd.

• Booth: N1185

  Press Releases

• Asmade | We Provide Comprehensive Solution for Semiconductor Packaging Process (Aug 12, 2024)

  About us:

  Asmade (Shenzhen) Semiconductor Technology Co.,Ltd., a national high-tech enterprise founded by international leading motion control expert team, gathered the industry's top packaging technology experts, focusing on the research and development of high-precision semiconductor equipment, manufacturing and sales. Dedicated to providing one-stop semiconductor packaging process solutions. The products have independent intellectual property rights.

  The company's main machines include Mini LED Wafer Transfer Equipment, Power Device Packaging Equipment, Advanced Packaging Equipment, Intelligent Control Equipment, and Semiconductor Packaging Process Management System. The company is committed to providing customers with a one-stop solution for their semiconductor packaging process, and all of its machines have full intellectual property rights. Several of the company's machines are industry-leading innovations.
  

• Machine | Pixel Die Bonder AS3601 (Aug 25, 2024)

  In the field of ultra-high definition direct display, we have pioneered the pixel die bond technology, which can effectively solve the efficiency bottleneck in traditional die-bonding processes. Pixel die bond technology, which is once locating, 3 colour die bond, representing an innovative "one-shot, three-die" model.

  It can drastically shortens the moving path and recognition times during the die-bonding process, both reduced to one-third of traditional methods, thereby significantly improving die-bonding efficiency while maintaining the same speed of mixed die-bonding. 
  Meanwhile, Pixel Die Bonder employs parallel electronic connection,  integrating substrate automatically back-in back-out layout with advanced pixel die-bonding processes.
  This not only greatly optimizes the operation rate but also ensures a smooth and safe manufacturing process. Additionally, this equipment is fully compatible with a wide range of direct display substrate sizes up to 270mm*520mm.

  

• Solution | Automatic Clip Bonding Solution AS2001 (Aug 25, 2024)

  In the field of power device packaging, We have introduced the Automatic Clip Bonding Solution AS2001, which encompasses five major process steps: Printer, Die Attach, Printer, Clip attach, and Reflow oven (with specific schemes and illustrations provided).
  In addition, the AS2001 boasts six primary advantages, which are: 
  I. Adopt stencil printing to improve printing efficiency and precision;
  II. Use a turret bonder with adjustable bonding angles and pressures; 
  III. Optional secondary printing on silicon wafers to achieve stacked packaging;
  IV. Equipped with CLIP bonding with motion shot for position correction and post-bonding inspection;
  V. Utilize a vacuum formic acid furnace to enhance welding yield and improve product stability; VI. Self-developed software operation and control platform for intelligent equipment operation.

  

  
   

  

• Machine | Epoxy Die Bonder AS8123 (Aug 25, 2024)

  In the field of semiconductor packaging, we also have introduced the Epoxy Die Bonder AS8123, a solution that integrates the third-generation chip placement mechanism featuring a tower-type architecture, ensuring unparalleled accuracy and efficiency. Its core strengths are embodied in the following aspects: Firstly, the AS8123 Epoxy Die Bonder exemplifies remarkable efficiency. It achieves this by eliminating reciprocation time for single material handling, thereby boosting operational efficiency by an impressive 60%. Secondly, the system showcases exceptional compatibility. It seamlessly accommodates both the Spot Gluing Process and the Dip Gluing Process, underscoring its versatility. Furthermore, it is designed to be fully compatible with wafers of various sizes, including 2-inch, 4-inch, 6-inch, 8-inch, and 12-inch. Lastly, AS8123 exhibits high precision. Equipped with an up-look function and precision compensation technology, it ensures accuracy in die placement.

  

• Solution | Mini LED intelligent manufacturing line (Aug 25, 2024)

  Confronted with the problems of enterprises manufacturing and Mini LED COB packing, we have proposed a Mini LED intelligent manufacturing line solution. It can one-stop solve the problem of manufacturing line construction, from equipment selection to software MES system, taking only 3 months from the establishment to manufacture. The Mini LED intelligent manufacturing line is composed of 32 Pixel Die Bonders and other intelligent equipment, occupying an area of only 220 square meters. It reduces labor consumption while increasing operating rates.

  We adopt the parallel line technology, where each machine works independently without interfering with each other. Even during single-machine maintenance, the remaining equipment on the entire line can continue to produce, breaking free from the constraints of the traditional single-machine manufacture mode. It can be adjusted and arranged according to the actual space conditions of the workshop, minimizing problems caused by equipment adjustments. The parallel line technology also makes it possible for multi-machine joint manufacture (products produced jointly by different equipment) and multi-product sharing a line (multiple products sharing the same manufacturing line).

  The Mini LED intelligent manufacturing line is equipped with an intelligent control system, enabling workers to quickly grasp the operation process. Only two people are required for one line, significantly reducing labor costs for enterprises and truly achieving cost reduction and efficiency improvement.

  The MES intelligent system also features Artificial intelligence Self-Correction Die Bond, which can effectively avoid die bonding defects in machines, thereby ensuring machines consistency and stability and improving machines yield.