In the field of ultra-high definition direct display, we have pioneered the pixel die bond technology, which can effectively solve the efficiency bottleneck in traditional die-bonding processes. Pixel die bond technology, which is once locating, 3 colour die bond, representing an innovative "one-shot, three-die" model.
It can drastically shortens the moving path and recognition times during the die-bonding process, both reduced to one-third of traditional methods, thereby significantly improving die-bonding efficiency while maintaining the same speed of mixed die-bonding.
Meanwhile, Pixel Die Bonder employs parallel electronic connection, integrating substrate automatically back-in back-out layout with advanced pixel die-bonding processes.
This not only greatly optimizes the operation rate but also ensures a smooth and safe manufacturing process. Additionally, this equipment is fully compatible with a wide range of direct display substrate sizes up to 270mm*520mm.