Tesec Corporation

  • Booth: Q5339

Overview

Dear Our Colleagues,

We are pleased to inform you that we, Tesec Corporation, will participate in SEMICON Taiwan 2024 to be held at Taipei Nangang Exhibition Centre in September.  Taking this occasion, we would like to express our cordial welcome and invitation to all of our valued overseas customers and colleagues to this exhibition.

TESEC has a large variety  of  testers  for  power  devices  thus  we  can provide various types of test service.
We will be introducing the following new products at the exhibition, so please stop by our booth.

Time:  September 6 (Wed) – 8(Fri) , 2024 

Place:  Taipei Nangang Exhibition Centre

Location and Booth :   #Q5339,  Hall2, First Floor

Products to be exhibited:

471-TT (Discrete Device Test System)
Other TESEC product line up:

・Film Frame Test Handler
・Die Sorter
・Gravity Handler
・MEMS Handler
・TAB Handler
・Discrete Device Test System
・IPD/IPM Test System
・Thermal Resistance Tester
・Inductive Load Tester
・Dynamic Test System

Very truly yours, 
https://www.tesec.co.jp/en/


  Products

  • Discrete Device Test System 471-TT
    471-TT is a DC tester with a new concept that realizes the simultaneous measurement of multiple chips in the wafer process....

  • Inheriting TESEC's strength in high-voltage and high-current measurement technology, the tester has significantly increased the productivity compared to the conventional testers by measuring multiple chips simultaneously.
    One-Pass test of Avalanche measurement*1 is supported to meet the demand of today's market.
    (*1) Dedicated measurement unit, which is only for 8 parallel model, is required. Also, it may not be applicable depending on the test condition and measurement environment.

    Feature

    ・Improved cost performance through simultaneous measurement of multiple chips (8 / 16 parallel)
    ・DC measurement and Avalanche measurement in 1 test system
    ・Significantly shortened the data transmission time by LAN connection
    ・Faster relay switching shortened the measurement time
    ・Parallel measurement is stabilized by our accumulated measurement technology (Max 2 kV / 20 A)
    ・Voltage and Current Limitation settings reduce the load on the probe pin
    ・Automatically calculate the number of chips to be measured simultaneously so that total required current of the chips to be lower than the predetermined maximum applicable current value (current capacity of the prober chuck)

  • Discrete Device Test System 431-TT
    This test system is designed to measure the static characteristics of discrete semiconductor devices....

  • 1.2 kV / 65 A (130 A for C-E) measurement is available as a standard and that can be expanded to 2.2 kV / 65 A (200 A for C-E). With an optional unit, at a maximum of 5 kV / 2000 A measurement is available.

    With its high versatility, the tester can be used in various applications such as the wafer test when a prober is connected and the final test when a handler is connected.

    Feature

    ・VI Source Measure Modules Structure
    ・1.2 kV / 130 A (up to 2.2 kV / 200 A ) measurement capability
    ・High Speed Measurement
    ・Multi-device test (Simultaneous measurement of 2-in-1 device such as Dual Gate FET2)
    ・Wafer parallel test (2-chip simultaneous measurement)
    ・On-Screen Waveform Monitor
    ・Conventional High Current Unit and High Voltage Unit of TESEC are applicable.

  • IPD/IPM Test System 530-IT
    IPD/IPM Test System 530-IT is designed with a new concept that incorporates the idea of IC tester into the DNA of power devices measurement technology TESEC has accumulated over many years....

  • It provides the optimized testing solutions for IPD/IPM, which is a combination of Logic ICs and Power Devices, and various other devices.

    Feature

    ・Utilized the measurement technology of testers for power discrete device.
    ・Maximum 2.2kV/67A (max 200A) measurement capability. Expandable by adding external units.
    ・Supports two device parallel measurements.
    ・Easy language-less test program creation (fill-in-the-blank method)
    ・High-speed leakage current measurement
    ・Various bias application waveforms and timing

  • Thermal Resistance Tester 4408-KT
    4408-KT is designed to measure the transient thermal resistance characteristics of GaN HEMT as the VGS's temperature change (ΔVGS).
    The measured value VGS1 and ΔVGS value are displayed on the front panel display....

  • Feature

    ・Measurement results are displayed on the front panel display
    ・Raised temperature ΔT can be displayed as a calculation result
    ・Thermal resistance Rth can be displayed as a calculation result
    ・Multi-test function
    ・60 test programs can be stored
    ・Contact Check/Open, Short Check
    ・Oscillation Detection
    ・Operation can be controlled from TESEC DC Tester
    ・Gate Limit Voltage can be set and Device Protection Circuit from over heating is equipped
    ・GP-IB/RS-232C interface enables external equipment to control this tester
    ・Function Check Unit (4321-AB) can be connected (option)

    ■ Optional Software Examples
    ・Software to control the tester from PC
    (Test program creation, data collection, and counter collection)
    ・Software to collect measurement data using the Function Check Unit

  • Inductive Load Tester 4602-LV
    4602-LV is designed to evaluate the Avalanche resistance based on how the waveform pass the Safe Operating Area (SOA) specified with the V-Gate, IH, and IL by monitoring the turn-off waveform of inductive load....

  • VDS(SUS) at the current value specified by the IH can also be measured.
    With the conventional measurement method, applied current is limited by applied voltage, moreover, the MOSFET has a characteristic that as the ON Resistance lowers the current required to measure increases; thus, the method became difficult to measure the MOSFET of medium breakdown voltage (several tens of voltage).
    To accomplish the task, new measurement methods* are added to perform the high current measurement, and the voltage and current this tester can apply are respectively increased to 300 V and 200 A so that it is now capable of measuring wider range of devices.
    *The VD-OFF mode is added to separate the VD power at Avalanche and the Time-Trip mode is added to turn the devices off after the applying current for specified time.

    Feature

    ・N/P channel measurement with one test head
    ・Peak Current (IDP) measurement at Avalanche test
    ・Gate ON Time measurement
    ・Repeat test up to 250 times
    ・Multi-test function (with fixed VD)
    ・60 test programs can be stored
    ・Programmable coil automates the coil switching (Option)
    ・VD-OFF mode (Optimized for Low ON Resistance MOSFET)
    ・Self-Check Function
    ・Time-Trip mode

    ■Optional Software Examples
    ・Software to control the tester from PC
    (Test program creation, data collection, and counter collection)

  • Dynamic Test System 3430-SW
    3430-SW is designed to measure the dynamic characteristics of IGBT/MOSFET devices at high speed....

  •  Parallel measurement is available at up to 4 test stations by connecting the 3430-SW and respective test stations provided for test items. (Standard: 2 test stations)
    Whole system can be controlled by on computer.

    Feature

    ・Low inductance structure reproduces ideal waveforms
    ・High speed waveform analysis shortened the test time drastically from the conventional model