T-GLOBAL TECHNOLOGY CO., LTD.

T-Global provides prompt and agile service, working closely with partners to find optimal thermal management solutions. We pride ourselves on our forward-looking culture, with a focus on new energy, 5G, electric vehicles and other emerging 
technologies, while building long-term, prosperous relationships with our partners. T-Global is helping to advance the next generation of technology through innovative thermal products and services. We offer a vast selection of heat dissipation materials and components and are committed to finding the most suitable thermal solutions for you.

T-Global's product development experience and sales expertise helps serve over 7,500 direct customers worldwide, not including distributors, such as Arris, Tesla Specialized, HP, Sony, Siemens, Sharp, Panasonic, Alcatel-Lucent, Asus, NEC, 
Bosch, Gigabyte, Jabil, Magna, Wistron, Sagem, Chimei-Innolux, CPT, Hannstar, Foxconn, Flextronics, AUO, AOC, D-link, TDK-Lambda, Delta, Liteon, HTC, LG, Cisco, and others.

T-Global has obtained ISO9001, ISO14001 and IECQ certifications which demonstrate high product quality and excellent management practices, and our products are RoHS, REACH and UL compliant and safety certified. Moving forward, we will strive to continue providing top-tier services to our customers, as well as refine our existing research and development technologies with the vision of becoming the most prominent thermal technology company in the world.

TG-A5000L Low Bleed Thermal Pad

‧ Low bleed
‧ High compressibility
‧ Self-adhesive
‧ High thermal conductivity... More Info Less Info





The TG-A5000L boasts a high conduction coefficient of 5.0W/m•K and is specifically engineered to meet the demands of high-performance computing. With advanced low bleed technology and excellent heat resistance, this material ensures devices can maintain stability and reliability at high temperatures, even during extended periods of operation.

---

Application：

Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.

---

Properties	Unit	TG-A5000L	Tolerance	Testing methods
Thermal Conductivity	W/m•K	5.0	±10%	ASTM D5470 Modified
Thickness	mm	0.5~8.0	-	ASTM D374
Color	-	Yellow	-	Colorimeter CIE 1976
Flame Rating	-	V-0	-	UL 94
Dielectric Breakdown Voltage	KV/mm	≥6	-	ASTM D149
Weight Loss	%	<1	-	ASTM E595 Modified
Density	g/cm³	3.4	±5%	ASTM D792
Operating Temperature	° C	-50~+150	-	-
Volume Resistivity	Ohm-m	10¹²	±10%	ASTM D257
Bleeding Width	mm	<3	-	T-Global Test Method
Elongation	%	90	-	ASTM D412
Standard Format	-	Sheet	-	-
Hardness	Shore OO	35	±10	ASTM D2240

 

T-Global Technology

Contact Ｕs : [email protected]｜+886-3-3618899

Product Link：TG-5000L Low Bleed Thermal Pad

T-Global Website：https://www.tglobalcorp.com/



TG-A1250 Ultra Soft Thermal Pad

‧ High thermal conductivity up to 12.5 W/m•K
‧ Low thermal resistance
‧ High compressibility and compliancy
‧ Electrical insulation... More Info Less Info





By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

TG-A1250 is an entry-level high thermal conductivity silicon film with 12.5W/m•K. Since 2019, it has been widely used in various electronic products, among which unmanned transportation vehicles, edge computing, industrial control hosts, servers, and other industries are the most.

---

Application：

Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.

---

Properties	Unit	TG-A1250	Tolerance	Testing methods
Thermal Conductivity	W/m•K	12.5	±10%	ASTM D5470 Modified
Thickness	mm	0.5~8.0	-	ASTM D374
Color	-	Green	-	Colorimeter CIE 1976
Flame Rating	-	V-0	-	UL 94
Dielectric Breakdown Voltage	KV/mm	≥10	-	ASTM D149
Weight Loss	%	<1	-	ASTM E595 Modified
Density	g/cm³	3.3	±5%	ASTM D792
Operating Temperature	° C	-50~+180	-	-
Volume Resistivity	Ohm-m	1×10¹³	-	ASTM D257
Elongation	%	40	-	ASTM D412
Standard Format	-	Sheet	-	-
Hardness	Shore OO	55	±10	ASTM D2240

T-Global Technology

Contact Ｕs : [email protected]｜+886-3-3618899

Product Link：TG-A1250 Ultra Soft Thermal Pad

T-Global Website：https://www.tglobalcorp.com/



TG-A7000 Thermal Putty

· Silicone-type spacer with great long term reliability
· Lower thermal resistance than thermal pads
· Physical property between liquid and solid state
· Elimination of different heat source gap & heat sink
· Can be applied with dispenser... More Info Less Info





TG-A7000 is a thermal putty T-Global has developed for the mortar industry with 7.0 W/m•K ultra-high thermal conductivity. It optimizes the heat dissipation performance of the product also it has an ultra-low heat group. This thermally conductive mortar is paste-like paste stickers, product design does not need to take special consideration of product size and tolerance restrictions, and can be flexibly designed according to the optimal effect of the design.

---

Application：

Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.

---

Properties	Unit	TG-A7000	Tolerance	Testing methods
Thermal Conductivity	W/m•K	7.0	±10%	ASTM D5470 Modified
Color	-	Green	-	Colorimeter CIE 1976
Viscosity	Pa·s	250	±100	Brookfield
Density	g/cm³	3.25	-	ASTM D792
Volume Resistivity	Ohm-m	10¹³	-	ASTM D257
Operating Temperature	° C	-50~+180	-	-
Standard Format	-	Tube/Pot	-	-

 

T-Global Technology

Contact Ｕs : [email protected]｜+886-3-3618899

Product Link：TG-A7000 Thermal Putty

T-Global Website：https://www.tglobalcorp.com/



TG-N8000 Non-Silicone Thermal Putty

‧ Lower contact thermal impedance than thermal pads
‧ Physical property in between liquid and solid state
‧ Gap fillers for uneven or irregular surfaces of heat sources and ‧ heat sink
‧ Applicable for dispenser... More Info Less Info





The high thermal conductivity material without added silicon oil is used to fill the gaps between electronic components and heat sinks. It retains stable thermal conductivity, resists loss and drying, and does not contaminate electronic components. With high temperature resistance and eco-friendly properties, it effectively transfers heat, ensuring optimal performance of electronic components under high temperatures and preventing damage due to overheating.

---

Application：

Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.

---

Properties	Unit	TG-N8000	Tolerance	Testing methods
Thermal Conductivity	W/m•K	8.0	-	ASTM D5470 Modified
Color	-	Yellow	-	Colorimeter CIE 1976
Viscosity	Pa·s	430	±100	Brookfield
Density	g/cm³	3	±0.15	ASTM D792
Volume Resistivity	Ohm-m	>10¹⁰	-	ASTM D257
Operating Temperature	° C	-40~+125	-	-
Standard Format	-	Tube/Pot	-	-

 

T-Global Technology

Contact Ｕs : [email protected]｜+886-3-3618899

Product Link：TG-N8000 Non-Silicone Thermal Putty

T-Global Website：https://www.tglobalcorp.com/



TG-AS808 / TG-S808 Thermal Paste

‧ High thermal conductivity
‧ Good leveling & no overflow
‧ Effectively fill up uneven surfaces
‧ Low thermal resistance/low thermal resistance
‧ Organic silicon base material has no environmental pollution... More Info Less Info





TG-AS808 is a thermal paste with 8 W/m•K thermal conductivity it has accumulated years of experience in the research and development of materials for T-Global. In the year 2019, it has launched as a conductive paste, which is also the highest coefficient of thermally conductive paste in the industry. It has good leveling and can effectively fill the unevenness of the metal contact surface. Improve thermal efficiency. Usually used for high-wattage wafers. 

---

Application：

Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.

---

Properties	Unit	TG-AS808 / TG-S808	Tolerance	Testing methods
Thermal Conductivity	W/m•K	8.0	±10%	ASTM D5470 Modified
Color	-	Gray	-	Colorimeter CIE 1976
Oil Dispersible	wt%	<0.1	-	24hr @150° C
Weight Loss	wt%	<0.1	-	ASTM E595 Modified
Viscosity	Pa·s	350	±100	Brookfield
Density	g/cm³	2.9	±5%	ASTM D792
Operating Temperature	° C	-40~+200	-	-
Volume Resistivity	Ohm-m	>10¹³	-	ASTM D257
Standard Format	-	Pot	-	-

 

T-Global Technology

Contact Ｕs : [email protected]｜+886-3-3618899

Product Link：TG-AS808 / TG-S808 Thermal Paste

T-Global Website：https://www.tglobalcorp.com/