UDM SYSTEMS LLC

RALEIGH,  NC 
United States
http://udmsystems.com
  • Booth: L0504

Overview

UDM Systems®, LLC is a global chemical manufacturing company based in the United States. We offer high-performance water-based, eco-friendly fluid that are suitable for many industries, such as Semiconductor, Solar, Optoelectronics, Biomedical, LED, Precision Glass & Optics, and much more.

Backed by more than 20 years of experience, we are confident that we can help you with all your semiconductor and solar wafer-die needs, we look forward to sharing with you in SEMICON 2024:

  1. Electronic grade cleaner for multi purposes: FLC200series.
  2. Dicing lubricant additive of high efficacy: L300 series.
  3. Lubricant for cutting Super-hard wafer (GaN, SiC, Quartz): AKLC400 and the newly developed L300-D5CMOS_B series.
  4. Laser coating material: LWC600 series.
  5. Accurate and Smart dispensing technology: ADU-14E1


  Products

  • FLC200 Series Multi-Purpose detergent
    FLC200 electronic grade cleaning agent is uniquely designed to remove contaminants and residues on semiconductor wafer surfaces as well as the surface of other substrate materials – glass, PCB boards and clean....

  • FLC200 electronic grade cleaning agent is uniquely designed to remove contaminants and residues on semiconductor wafer surfaces as well as the surface of other substrate materials – glass, PCB boards and clean

    It is specially formulated aqueous concentrate designed to dissolve and remove all types of fluxes left on parts after PCB-SMT soldering process. Flc200 penetrates isolated and tight-tolerance areas to quickly dissolve and remove non-ionic and ionic contaminants left on the non-component side of circuit boards. And like all our products, FLC200 is completely biodegradable and environmentally friendly.

  • AKLC400 Series and L300 D5CMOS_B heavy lubricant
    AKLC400 and D5CMOS_B are perfect for slicing and cutting hard materials - Sapphire, GaN, SiC, Quartz glass and Electronic Package Singulation....

  • AKLC400 and D5CMOS_B are perfect for slicing and cutting hard materials - Sapphire, GaN, SiC, Quartz glass and Electronic Package Singulation.   AKLC400 and D5CMOS_B are revolutionary materials that offers excellent heat transfer, extends diamond wire and Blade life, improves wafer-die reliability and is extremely environmentally friendly.
  • Wafer Dicing Lubricants – L300 Series
    Our L300 Series Dicing Lubricants are ideal for enhancing die-separation process to maximize yields and improve customer profitability....

  • Our L300 Series Dicing Lubricants are ideal for enhancing die-separation process to maximize yields and improve customer profitability. The UDM Systems® L-Series lubricants are specifically designed to prevent galvanic corrosion, reduce electrostatic buildup, dissipate heat, and enhance lubrication, hence enabling sawdust dispersion and cleaner bonding pads. L-Series lubricants are biodegradable, non-corrosive aqueous solution and completely DI (deionized) water-soluble. 
  • LWC600 Series Wafer Coating Material
    LWC600 is designed to protect wafer surfaces while laser dicing/cutting semiconductor wafers. It has a unique feature that effectively prevents debris and residue from adhering/sticking to the wafer surface during wafer laser dicing process....

  • LWC600 is designed to protect wafer surfaces while laser dicing/cutting semiconductor wafers. It has a unique feature that effectively prevents debris and residue from adhering/sticking to the wafer surface during wafer laser dicing process.

  • ADU-14E1 & LDS 2000 inline dispenser
    The ADU 14E1 and LDS 2000 dispensers are electrically synchronized to the dicing saws to dispense lubricants into saw DI water line, recipes and data can be controlled remotely and collected like industrial 4.0 and also certified by SEMI-S2....

  • The ADU 14E1 and LDS 2000 dispensers are electrically synchronized to the dicing saws to dispense lubricants into saw DI water line, recipes and data can be controlled remotely and collected like industrial 4.0 and also certified by SEMI-S2. The lubricant flow is controlled by a digital pumping unit, which precisely dispenses the exact volume of lubricant material. The systems self-monitors and recalibrates automatically to maintain set dispensing volume of the lubricant.