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PLANOPTIK AG

Elsoff,  Germany
http://www.planoptik.com
  • Booth: N0566

Glass, fused silica and silicon for MEMS and semiconductors.

Overview

PLANOPTIK AG, a public company from Germany produces wafers from glass, quartz and glass-silicon-compounds. Main products are wafers and process carriers from glass, fused silica and glass-silicon compounds for MEMS, wafer level packaging and semiconductor applications. PLANOPTIK's wafers are machined to very tight thickness tolerance and total thickness variation. Sub-nanometer roughness and materials with adapted coefficient of thermal expansion to semiconductor materials are the main features of these substrates and carriers. All wafers are clean room packed. Diameters from 50 to 300 mm, typical thickness from 100 to 3000 micron. PLANOPTIK has set the standard in respect to high end substrates for the MEMS and semiconductor industry.