Welcome to Hugle Electronics Inc.
Overview
As it is widely known, technical innovation of semiconductors is aiming at endless high integration&, and the environment of their production and inspection inevitably require "super" pureness and cleanliness.
Since Hugle has stuck resolutely to the originality and focused on the pure and clean system which no other company manufactured, Hugle has developed and manufactured a large number of creative products.
Hugle shows the movie of UPC-12500 which has obtained the highest rating in the world as FOUP Cleaning system, SF-300 which Next generation NEW FOUP Cleaning system, SF-200 which is NEW EUV/DUV Pod cleaning system.
We also have a lineup of cleaning equipment for special containers used in production lines for HCP, AI, HBM, etc. that are manufactured using Hybrid 3D Chip Stacking process (COW, WOW) technology.
For next-generation packaging technology, we are developing cleaning equipment for containers used in the PLP process.